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BUL146

P1-P3P4-P6P7-P9P10-P11
BUL146G, BUL146FG
http://onsemi.com
7
-5
-4
-3
-2
-1
0
1
2
3
4
5
012345678
Figure 18. Dynamic Saturation Voltage Measurements
TIME
V
CE
VOLTS
I
B
Figure 19. Inductive Switching Measurements
1 ms
3 ms
90% I
B
dyn 1 ms
dyn 3 ms
10
9
8
7
6
5
4
3
2
1
0
012 34567 8
TIME
I
B
I
C
t
si
V
CLAMP
10% V
CLAMP
90% I
B
1
10% I
C
t
c
90% I
C
t
fi
Table 1. Inductive Load Switching Drive Circuit
+15 V
1 mF
150 W
3 W
100 W
3 W
MPF930
+10 V
50 W
COMMON
-V
off
500 mF
MPF930
MTP8P10
MUR105
MJE210
MTP12N10
MTP8P10
150 W
3 W
100 mF
I
out
A
1 mF
I
C
PEAK
V
CE
PEAK
V
CE
I
B
I
B
1
I
B
2
V(BR)CEO(sus)
L = 10 mH
RB2 = ∞
V
CC
= 20 VOLTS
I
C
(pk) = 100 mA
INDUCTIVE SWITCHING
L = 200 mH
RB2 = 0
V
CC
= 15 VOLTS
RB1 SELECTED FOR
DESIRED I
B
1
RBSOA
L = 500 mH
RB2 = 0
V
CC
= 15 VOLTS
RB1 SELECTED
FOR DESIRED I
B
1
R
B2
R
B1
BUL146G, BUL146FG
http://onsemi.com
8
0.01
t, TIME (ms)
Figure 20. Typical Thermal Response (Z
q
JC
(t)) for BUL146
r(t), TRANSIENT THERMAL RESISTANCE
(NORMALIZED)
R
q
JC
(t) = r(t) R
q
JC
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t
1
T
J(pk)
- T
C
= P
(pk)
R
q
JC
(t)
P
(pk)
t
1
t
2
DUTY CYCLE, D = t
1
/t
2
0.2
0.02
0.1
D = 0.5
SINGLE PULSE
0.01 0.1 1 10 100 1000
0.1
1
0.05
TYPICAL THERMAL RESPONSE
R
q
JC
(t) = r(t) R
q
JC
R
q
JC
= 3.125°C/W MAX
D CURVES APPLY FOR
POWER PULSE TRAIN
SHOWN READ TIME AT t
1
T
J(pk)
- T
C
= P
(pk)
R
q
JC
(t)
P
(pk)
t
1
t
2
DUTY CYCLE, D = t
1
/t
2
0.01
t, TIME (ms)
Figure 21. Typical Thermal Response for BUL146F
r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED)
0.2
0.1
0.01 0.10 1.00 10.00 100.00 1000
0.10
1.00
0.02
0.05
SINGLE PULSE
D = 0.5
ORDERING INFORMATION
Device Package Shipping
BUL146G TO−220AB
(Pb−Free)
50 Units / Rail
BUL146FG TO−220 (Fullpack)
(Pb−Free)
50 Units / Rail
BUL146G, BUL146FG
http://onsemi.com
9
MOUNTED
FULLY ISOLATED
PACKAGE
LEADS
HEATSINK
0.110″ MIN
Figure 22a. Screw or Clip Mounting
Position for Isolation Test Number 1
*Measurement made between leads and heatsink with all leads shorted together
CLIP
MOUNTED
FULLY ISOLATED
PACKAGE
LEADS
HEATSINK
CLIP
0.099″ MIN
MOUNTED
FULLY ISOLATED
PACKAGE
LEADS
HEATSINK
0.099″ MIN
Figure 22b. Clip Mounting Position
for Isolation Test Number 2
Figure 22c. Screw Mounting Position
for Isolation Test Number 3
TEST CONDITIONS FOR ISOLATION TESTS*
4-40 SCREW
PLAIN WASHER
HEATSINK
COMPRESSION WASHER
NUT
CLIP
HEATSINK
Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting technique, a
screw torque of 6 to 8 in
.
lbs is sufficient to provide maximum power dissipation capability. The compression washer helps to maintain
a constant pressure on the package over time and during large temperature excursions.
Destructive laboratory tests show that using a hex head 4−40 screw, without washers, and applying a torque in excess of 20 in
.
lbs will
cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability.
Additional tests on slotted 4−40 screws indicate that the screw slot fails between 15 to 20 in
.
lbs without adversely affecting the
package. However, in order to positively ensure the package integrity of the fully isolated device, ON Semiconductor does not recom-
mend exceeding 10 in
.
lbs of mounting torque under any mounting conditions.
Figure 23. Typical Mounting Techniques
for Isolated Package
Figure 23a. Screw−Mounted Figure 23b. Clip−Mounted
MOUNTING INFORMATION**
** For more information about mounting power semiconductors see Application Note AN1040.
P1-P3P4-P6P7-P9P10-P11

BUL146

Mfr. #:
Buy BUL146
Manufacturer:
ON Semiconductor
Description:
TRANS NPN 400V 6A TO-220AB
Lifecycle:
New from this manufacturer.
Delivery:
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