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CM1230-08CP

P1-P3P4-P6P7-P8
CM1230
http://onsemi.com
4
PERFORMANCE INFORMATION
Input Channel Capacitance Performance Curves
Figure 1. Typical Variation of C
IN
vs. V
IN
(f = 1 MHz, V
P
= 3.3 V, V
N
= 0 V, 0.1 mF chip capacitor between V
P
and V
N
, T
A
= 255C)
Figure 2. Typical Variation of C
IN
vs. Temp
(f = 1 MHz, V
IN
= 30 mV, V
P
= 3.3 V, V
N
= 0 V, 0.1 mF chip capacitor between V
P
and V
N
)
CM1230
http://onsemi.com
5
PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment)
Figure 3. Insertion Loss vs. Frequency (0 V DC Bias, V
P
= 3.3 V)
Figure 4. Insertion Loss vs. Frequency (2.5 V DC Bias, V
P
= 3.3 V)
CM1230
http://onsemi.com
6
APPLICATION INFORMATION
Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS
Parameter Value
Pad Size on PCB 0.275 mm
Pad Shape Round
Pad Definition Non−Solder Mask defined pads
Solder Mask Opening 0.325 mm Round
Solder Stencil Thickness 0.125 − 0.150 mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330 mm Round
Solder Flux Ratio 50/50 by volume
Solder Paste Type No Clean
Pad Protective Finish OSP (Entek Cu Plus 106A)
Tolerance − Edge To Corner Ball
±50 mm
Solder Ball Side Coplanarity
±20 mm
Maximum Dwell Time Above Liquidous 60 seconds
Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste 260°C
Non−Solder Mask Defined Pad
0.275 mm DIA.
Solder Stencil Opening
0.330 mm DIA.
Solder Mask Opening
0.325 mm DIA.
Figure 5. Recommended Non−Solder Mask Defined Pad Illustration
Figure 6. Lead−free (SnAgCu) Solder Ball Reflow Profile
P1-P3P4-P6P7-P8

CM1230-08CP

Mfr. #:
Buy CM1230-08CP
Manufacturer:
ON Semiconductor
Description:
TVS Diodes / ESD Suppressors 8-CH PICO GUARD
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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