Integrated Silicon Solution, Inc. 1
Rev. A
11/09/2010
Copyright © 2010 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the lat-
est version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reason-
ably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications
unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
IS42SM32160C
IS42RM32160C
NOVEMBER 2010
FEATURES:
Fully synchronous; all signals referenced to a
positive clock edge
Internal bank for hiding row access and pre-
charge
Programmable CAS latency: 2, 3
Programmable Burst Length: 1, 2, 4, 8, and Full
Page
Programmable Burst Sequence:
Sequential and Interleave
Auto Refresh (CBR)
TCSR (Temperature Compensated Self Refresh)
PASR (Partial Arrays Self Refresh): 1/16, 1/8,
1/4, 1/2, and Full
Deep Power Down Mode (DPD)
Driver Strength Control (DS): 1/4, 1/2, and Full
OPTIONS:
Configuration: 16Mx32
Power Supply:
IS42SMxxx - V
dd/Vddq = 3.3V
IS42RMxxx - V
dd/Vddq = 2.5V
Package: 90 Ball BGA (8x13mm)
Temperature Range:
Commercial (0
o
C to +70
o
C)
Industrial (-40
o
C to +85
o
C)
Die revision: C
16Mx32
512Mb Mobile Synchronous DRAM
DESCRIPTION:
ISSI's IS42SM/RM32160C is a 512Mb Mobile Syn-
chronous DRAM configured as a quad 4M x32 DRAM.
It achieves high-speed data transfer using a pipeline
architecture with a synchronous interface. All inputs and
outputs signals are registered on the rising edge of the
clock input, CLK. The 512Mb SDRAM is internally con-
figured by stacking two 256Mb, 16Mx16 devices. Each
of the 4M x32 banks is organized as 8192 rows by 512
columns by 32 bits.
KEY TIMING PARAMETERS
Parameter -7 -75 Unit
CLK Cycle Time
CAS Latency = 3
7 7.5 ns
CAS Latency = 2
9.6 9.6 ns
CLK Frequency
CAS Latency = 3
143 133 Mhz
CAS Latency = 2
104 104 Mhz
Access Time from CLK
CAS Latency = 3
5.4 5.4 ns
CAS Latency = 2
7 7 ns
ADDRESS TABLE
Parameter 16Mx32
Configuration 4M x 32 x 4 banks
Bank Address Pins BA0, BA1
Autoprecharge Pins A10/AP
Row Addresses A0 – A12
Column Addresses A0 – A8
Refresh Count 8K / 64ms
2 Integrated Silicon Solution, Inc.
Rev. A
11/09/2010
IS42SM32160C
IS42RM32160C
FUNCTIONAL BLOCK DIAGRAM (16Mx16)
CLK
CKE
CS
RAS
CAS
WE
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
BA0
BA1
A10
A12
COMMAND
DECODER
&
CLOCK
GENERATOR
MODE
REGISTER
REFRESH
CONTROLLER
REFRESH
COUNTER
SELF
REFRESH
CONTROLLER
ROW
ADDRESS
LATCH
MULTIPLEXER
COLUMN
ADDRESS LATCH
BURST COUNTER
COLUMN
ADDRESS BUFFER
COLUMN DECODER
DATA IN
BUFFER
DATA OUT
BUFFER
DQML
DQMH
DQ 0-15
V
DD
/V
DDQ
V
ss
/V
ss
Q
13
13
9
13
13
9
16
16 16
16
512
(x 16)
8192
8192
8192
ROW DECODER
8192
MEMORY CELL
ARRAY
BANK 0
SENSE AMP I/O GATE
BANK CONTROL LOGIC
ROW
ADDRESS
BUFFER
A11
2
FUNCTIONAL BLOCK DIAGRAM (16Mx32)
Die 01 Die 02
DQ0 D
Q31
CS
CLK
CKE
Command
Addresses
Integrated Silicon Solution, Inc. 3
Rev. A
11/09/2010
IS42SM32160C
IS42RM32160C
Symbol Type Description
CLK Input
Clock: CLK is driven by the system clock. All SDRAM input signals are sampled on the positive edge of
CLK. CLK also increments the internal burst counter and controls the output registers.
CKE Input
Clock Enable: CKE activates (HIGH) and deactivates (LOW) the CLK signal. If CKE goes low synchronously
with clock (set-up and hold time same as other inputs), the internal clock is suspended from the next clock
cycle and the state of output and burst address is frozen as long as the CKE remains low. When all banks
are in the idle state, deactivating the clock controls the entry to the Power Down and Self Refresh modes.
CKE is synchronous except after the device enters Power Down and Self Refresh modes, where CKE
becomes asynchronous until exiting the same mode. The input buffers, including CLK, are disabled during
Power Down and Self Refresh modes, providing low standby power.
BA0, BA1 Input
Bank Select: BA0 and BA1 defines to which bank the BankActivate, Read, Write, or BankPrecharge
command is being applied.
A0-A12 Input
Address Inputs:A0-A12 are sampled during the BankActivate command (row address A0-A12) and Read/
Write command (column address A0-A8 with A10 defining Auto Precharge) to select one location in the
respective bank. During a Precharge command,A10 is sampled to determine if all banks are to be precharged
(A10 =HIGH).
The address inputs also provide the op-code during a Mode Register Set .
CS
Input
Chip Select: CS enables (sampled LOW) and disables (sampled HIGH) the command decoder.All commands
are masked when CS is sampled HIGH. CS provides for external bank selection on systems with multiple
banks. It is considered part of the command code.
RAS
Input
Row Address Strobe: The RAS signal defines the operation commands in conjunction with the CAS and
WE signals and is latched at the positive edges of CLK. When RAS and CS are asserted “LOW” and CAS
is asserted “HIGH,” either the BankActivate command or the Precharge command is selected by the WE
signal. When the WE is asserted “HIGH, the BankActivate command is selected and the bank designated
by BA is turned on to the active state. When the WE is asserted “LOW,the Precharge command is selected
and the bank designated by BA is switched to the idle state after the precharge operation.
CAS
Input
Column Address Strobe: The CAS signal defines the operation commands in conjunction with the RAS
and WE signals and is latched at the positive edges of CLK. When RAS is held “HIGH” and CS is asserted
“LOW, the column access is started by asserting CAS ”LOW. Then, the Read or Write command is selected
by asserting WE “LOW” or “HIGH.
WE
Input
Write Enable: The WE signal defines the operation commands in conjunction with the RAS and CAS signals
and is latched at the positive edges of CLK. The WE input is used to select the BankActivate or Precharge
command and Read or Write command.
DQM0-3 Input
Data Input/Output Mask: DQM0-DQM3 are byte specific, nonpersistent I/O buffer controls. The I/O buffers
are placed in a high-z state when DQM is sampled HIGH. Input data is masked when DQM is sampled
HIGH during a write cycle. Output data is masked (two-clock latency) when DQM is sampled HIGH during
a read cycle. DQM3 masks DQ31-DQ24, DQM2 masks DQ23-DQ16, DQM1 masks DQ15-DQ8, and DQM0
masks DQ7-DQ0
DQ0-31 Input/
Output
Data I/O: The DQ0-31 input and output data are synchronized with the positive edge of CLK. The I/Os are
byte-maskable during Reads and Writes.
PIN DESCRIPTIONS

IS42RM32160C-75BLI

Mfr. #:
Manufacturer:
ISSI
Description:
DRAM 512M (16Mx32) 133MHz 2.5v Mobile SDR
Lifecycle:
New from this manufacturer.
Delivery:
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