Electrical characteristics STP/F21NM50N - STB21NM50N - STB21NM50N-1 - STW21NM50N
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2 Electrical characteristics
(T
CASE
=25°C unless otherwise specified)
Table 4. On/off states
Symbol Parameter Test conditions
Value
Unit
Min. Typ. Max.
V
(BR)DSS
Drain-source
breakdown voltage
I
D
= 1mA, V
GS
= 0 500 V
dv/dt
(1)
1. Characteristic value at turn off on inductive load
Drain source voltage slope
V
DD
=400V, I
D
=25A,
V
GS
=10V
44 V/ns
I
DSS
Zero gate voltage
drain current (V
GS
= 0)
V
DS
= Max rating
V
DS
= Max rating,T
C
@125°C
1
10
µA
µA
I
GSS
Gate-body leakage
current (V
DS
= 0)
V
GS
= ± 20V 100 nA
V
GS(th)
Gate threshold voltage V
DS
= V
GS
, I
D
= 250µA 2 3 4 V
R
DS(on
Static drain-source on
resistance
V
GS
= 10V, I
D
= 9A 0.150 0.190
Table 5. Dynamic
Symbol Parameter Test conditions Min. Typ. Max. Unit
g
fs
(1)
1. Pulsed: pulse duration=300µs, duty cycle 1.5%
Forward transconductance V
DS
= 15V
,
I
D
= 9A 12 S
C
iss
C
oss
C
rss
Input capacitance
Output capacitance
Reverse transfer
capacitance
V
DS
= 25V, f = 1 MHz,
V
GS
= 0
1950
420
60
pF
pF
pF
C
oss eq.
(2)
2. C
oss eq
. is defined as a constant equivalent capacitance giving the same charging time as C
oss
when V
DS
increases from 0 to 80% V
DSS
Equivalent output
capacitance
V
GS
= 0V, V
DS
= 0V to 400V 270 pF
t
d(on)
t
r
t
d(off)
t
f
Turn-on delay time
Rise time
Turn-off delay time
Fall time
V
DD
=250V, I
D
= 9A
R
G
=4.7 V
GS
= 10V
(see Figure 15.)
22
18
90
30
ns
ns
ns
ns
Q
g
Q
gs
Q
gd
Total gate charge
Gate-source charge
Gate-drain charge
V
DD
= 400V, I
D
= 18A,
V
GS
= 10V,
(see Figure 16.)
65
10
30
nC
nC
nC
R
g
Gate input resistance
f=1MHz Gate DC Bias=0
test signal level=20mV
open drain
1.6
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STP/F21NM50N - STB21NM50N - STB21NM50N-1 - STW21NM50N Electrical characteristics
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Table 6. Source drain diode
Symbol Parameter Test conditions Min. Typ. Max. Unit
I
SD
I
SDM
(1)
1. Pulse width limited by safe operating area
Source-drain current
Source-drain current (pulsed)
18
72
A
A
V
SD
(2)
2. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
Forward on voltage I
SD
= 18A, V
GS
= 0 1.5 V
t
rr
Q
rr
I
RRM
Reverse recovery time
Reverse recovery charge
Reverse recovery current
I
SD
= 18A,
di/dt=100A/µs
V
DD
= 100V,
(see Figure 17.)
360
5
27
ns
µC
A
t
rr
Q
rr
I
RRM
Reverse recovery time
Reverse recovery charge
Reverse recovery current
I
SD
= 18A,
di/dt=100A/µs
V
DD
= 100V, T
j
= 150°C
(see Figure 17.)
464
6.5
27
ns
µC
A
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Electrical characteristics STP/F21NM50N - STB21NM50N - STB21NM50N-1 - STW21NM50N
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2.1 Electrical characteristics (curves)
Figure 1. Safe operating area Figure 2. Thermal impedance
Figure 3. Safe operating area for TO-220FP Figure 4. Thermal impedance for TO-220FP
Figure 5. Output characteristics Figure 6. Transfer characteristics
Obsolete Product(s) - Obsolete Product(s)

STP21NM50N

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
MOSFET N-Ch 500 V 0.15 Ohm 18 A 2nd Gen MDmesh
Lifecycle:
New from this manufacturer.
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