GE
Data Sheet
QPW050/060 Series Power Modules; DC-DC converters
36-75Vdc Input; 1.2Vdc to 3.3Vdc Output
October 5, 2015 ©2012 General Electric Company. All rights reserved. Page 20
Layout Considerations
The QPW power module series are low profile in order to
be used in fine pitch system card architectures. As such,
component clearance between the bottom of the power
module and the mounting board is limited. Avoid placing
copper areas on the outer layer directly underneath the
power module. Also avoid placing via interconnects
underneath the power module.
For additional layout guide-lines, refer to FLTR100V10
data sheet.
Post solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both
the reliability of a power module and the testability of
the finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to GE Board Mounted Power Modules: Soldering and
Cleaning Application Note.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes. A
maximum preheat rate of 3C/s is suggested. The wave
preheat process should be such that the temperature of
the power module board is kept below 210C. For Pb
solder, the recommended pot temperature is 260C,
while the Pb-free solder pot is 270C max. Not all RoHS-
compliant through-hole products can be processed with
paste-through-hole Pb or Pb-free reflow process. If
additional information is needed, please consult with
your GE representative for more details.
