STANDARD
SIZE
A
5962-89581
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET
3
DSCC FORM 2234
APR 97
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed
below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q
designators will not be included in the PIN and will not be marked on the device.
Device class Device requirements documentation
M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Q or V Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style
G MACY1-X8 8 Can
H GDFP1-F10 or CDFP2-F10 10 Flat pack
P GDIP1-T8 or CDIP2-T8 8 Dual-in-line
2 CQCC1-N20 20 Square leadless chip carrier
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 1/
Input voltage (V
IN
) ....................................................................................... 40 V dc
Power dissipation (P
D
) ................................................................................ 500 mW 2/
Output short circuit duration ......................................................................... Indefinite
Storage temperature range .......................................................................... -65°C to +150°C
Lead temperature (soldering, 10 seconds) .................................................. +300°C
Junction temperature (T
J
) ............................................................................ +150°C
Thermal resistance, junction-to-case (θ
JC
) .................................................. See MIL-STD-1835
1.4 Recommended operating conditions.
Ambient operating temperature range (T
A
) ................................................. -55°C to +125°C
1.5 Radiation features:
Device type 01:
Maximum total dose available (dose rate = 50 – 300 rads(Si)/s) ............. 100 krads(Si) 3/
Device type 05:
Maximum total dose available (dose rate ≤ 10 mrads(Si)/s) .................... 50 krads(Si) 4/
________
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ Derate above +80°C, 7.1 mW/°C for case outline G. Derate above +75°C, 6.6 mW/°C for case outline P.
Derate above +72°C, 7.8 mW/°C for case outline 2. Derate above +85°C, 5.6 mW/°C for case outline H.
3/ For device type 01, this part may be dose rate sensitive in a space environment and may demonstrate enhanced low
dose rate effects. Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in
MIL-STD-883, method 1019, condition A.
4/ For device type 05, radiation end point limits for the noted parameters are guaranteed for the conditions specified in
MIL-STD-883, method 1019, condition D.
