DocID028611 Rev 1 5/10
STPTIC-27L2 Package information
10
2 Package information
• Epoxy meets UL94, V0
• Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
2.1 Flip-Chip package information
Figure 7. Flip-Chip package outline
The land pattern below is recommended for soldering the STPTIC-G2 on PCB.
NC stands for No Connect, this pad must not be connected on application board. Please
leave this pad floating.
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Table 4. Flip-Chip package dimensions
Dimensions (in microns) A1 A2 B1 B2 B4 C1 C2 D1 D2 D3 E1 E2
STPTIC-27L2 1000 750 140 500 360 105 540 225 90 315 125 165
Tolerance ±30 ±30 ±15 ±10 ±15 ±15 ±10 ±20 ±20 ±40 ±20 ±20
