STPTIC-27L2C5

DocID028611 Rev 1 7/10
STPTIC-27L2 Package information
10
Figure 10. Flip-Chip marking
Table 7. Pinout description
Pad / ball number Pin name Description
A1 DC bias DC bias voltage
B1 RF2 RF input / output
(1)
1. When connected in shunt, please connect RF2 (B1 ball) to GND
A2 NC Not connected
B2 RF1 RF input / output
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Reflow profile STPTIC-27L2
8/10 DocID028611 Rev 1
3 Reflow profile
Figure 11. ST ECOPACK
®
recommended soldering reflow profile for PCB mounting
Note: Minimize air convection currents in the reflow oven to avoid component movement.
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Table 8. Recommended values for soldering reflow
Profile
Value
Typical Max.
Temperature gradient in preheat (T = 70-180 °C) 0.9 °C/s 3 °C/s
Temperature gradient (T = 200-225 °C) 2 °C/s 3 °C/s
Peak temperature in reflow 240-245 °C 260 °C
Time above 220 °C 60 s 90 s
Temperature gradient in cooling -2 to -3 °C/s -6 °C/s
Time from 50 to 220 °C 160 to 220 s
DocID028611 Rev 1 9/10
STPTIC-27L2 Ordering information
10
4 Ordering information
Figure 12. Ordering information scheme
5 Revision history
Table 9. Ordering information
Part number Marking Base qty Package Delivery mode
STPTIC-27L2C5 27L 15 000 Flip-Chip Tape and reel
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Table 10. Document revision history
Date Revision Changes
04-Dec-2015 1 Initial release.

STPTIC-27L2C5

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Cap Tunable Integrated Capacitor 2.7pF Solder Ball SMD 85C T/R
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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