MC74HC139A
http://onsemi.com
3
MAXIMUM RATINGS
Symbol Parameter Value Unit
V
CC
DC Supply Voltage (Referenced to GND) 0.5 to 7.0 V
V
IN
DC Input Voltage (Referenced to GND) 1.5 to V
CC
1.5 V
V
OUT
DC Output Voltage (Referenced to GND) (Note 1) 0.5 to V
CC
0.5 V
I
IN
DC Input Current, per Pin 20 mA
I
OUT
DC Output Current, per Pin 25 mA
I
CC
DC Supply Current, V
CC
Pin 50 mA
I
GND
DC Ground Current per Ground Pin 50 mA
T
STG
Storage Temperature Range 65 to 150
_C
T
L
Lead Temperature, 1 mm from Case for 10 Seconds 260
_C
T
J
Junction Temperature Under Bias 150
_C
q
JA
Thermal Resistance PDIP
SOIC
TSSOP
78
112
148
_C/W
P
D
Power Dissipation in Still Air at 85_C PDIP
SOIC
TSSOP
750
500
450
mW
MSL Moisture Sensitivity Level 1
F
R
Flammability Rating Oxygen Index: 30% − 35% UL 94 V−0 @ 0.125 in
V
ESD
ESD Withstand Voltage Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
2000
200
1000
V
I
LATCHUP
Latchup Performance Above V
CC
and Below GND at 85_C (Note 5)
300 mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. I
O
absolute maximum rating must be observed.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
V
CC
DC Supply Voltage (Referenced to GND) 2.0 6.0 V
V
IN
, V
OUT
DC Input Voltage, Output Voltage (Referenced to GND) 0 V
CC
V
T
A
Operating Temperature, All Package Types 55 125
_C
t
r
, t
f
Input Rise and Fall Time V
CC
= 2.0 V
(Figure 3) V
CC
= 4.5 V
V
CC
= 6.0 V
0
0
0
1000
500
400
ns
6. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level.
