© Semiconductor Components Industries, LLC, 2012
May, 2012 Rev. 5
1 Publication Order Number:
NB6L14/D
NB6L14
2.5 V/3.3 V 3.0 GHz
Differential 1:4 LVPECL
Fanout Buffer
MultiLevel Inputs with Internal Termination
Description
The NB6L14 is a 3.0 GHz differential 1:4 LVPECL clock or data
fanout buffer. The differential inputs incorporate internal 50
termination resistors that are accessed through the VT pin. This feature
allows the NB6L14 to accept various logic standards, such as
LVPECL, LVCMOS, LVTTL, CML, or LVDS logic levels. The
VREF_AC reference output can be used to rebias capacitorcoupled
differential or singleended input signals. The 1:4 fanout design was
optimized for low output skew applications.
The NB6L14 is a member of the ECLinPS MAX family of high
performance clock and data management products.
Features
Input Clock Frequency > 3.0 GHz
Input Data Rate > 2.5 Gb/s
< 20 ps Within Device Output Skew
350 ps Typical Propagation Delay
150 ps Typical Rise and Fall Times
Differential LVPECL Outputs, 700 mV Amplitude, Typical
LVPECL Mode Operating Range: V
CC
= 2.375 V to 3.63 V with
GND = 0 V
Internal 50 Input Termination Resistors Provided
VREF_AC Reference Output Voltage
40°C to +85°C Ambient Operating Temperature
Available in 3 mm x 3 mm 16 Pin QFN
These are PbFree Devices
MARKING
DIAGRAM*
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QFN16
MN SUFFIX
CASE 485G
NB6L
14
ALYWG
G
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = PbFree Package
(Note: Microdot may be in either location)
16
1
*For additional marking information, refer to
Application Note AND8002/D.
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
ORDERING INFORMATION
QD
Figure 1. Simplified Logic Diagram
Q0
Q0
Q1
Q1
Q2
Q2
Q3
Q3
IN
VT
IN
EN
VREFAC
1
NB6L14
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2
Q3 V
CC
Q0 Q0 V
CC
IN
VREF_AC
Q2
5678
16 15 14 13
12
11
10
9
1
2
3
4
Exposed Pad (EP)
Figure 2. QFN16 Pinout
(Top View)
GND
VT
IN
Q3 EN
Q2
Q1
Q1
Figure 3. Logic Diagram
Q0
/Q0
Q1
/Q1
Q2
/Q2
Q3
/Q3
QD
IN
50
50
VT
/IN
EN
VREF_AC
CLK
Table 1. EN TRUTH TABLE
IN IN EN Q0:Q3 Q0:Q3
0
1
x
1
0
x
1
1
0
0
1
0+
1
0
1+
+ = On next negative transition of the input signal (IN).
x = Don’t care.
Table 2. PIN DESCRIPTION
Pin Name I/O Description
1 Q1 LVPECL Output
Noninverted Differential Output. Typically Terminated with 50 Resistor to
V
CC
–2.0 V.
2 Q1 LVPECL Output
Inverted Differential Output. Typically Terminated with 50 Resistor to V
CC
– 2.0 V.
3 Q2 LVPECL Output
Noninverted Differential Output. Typically Terminated with 50 Resistor to
V
CC
– 2.0 V.
4 Q2 LVPECL Output
Inverted Differential Output. Typically Terminated with 50 Resistor to V
CC
– 2.0 V.
5 Q3 LVPECL Output
Noninverted Differential Output. Typically Terminated with 50 Resistor to
V
CC
– 2.0 V.
6 Q3 LVPECL Output
Inverted Differential Output. Typically Terminated with 50 Resistor to V
CC
– 2.0 V.
7 V
CC
Positive Supply Voltage
8 EN LVTTL/LVCMOS Synchronous Output Enable. When LOW, Q outputs will go LOW and Q outputs will
go HIGH on the next negative transition of IN input. The internal DFF register is
clocked on the falling edge of IN input (see Figure 20). The EN pin has an internal
pullup resistor and defaults HIGH when left open.
9 IN LVPECL, CML,
LVDS, HSTL
Inverted Differential Clock Input. Internal 50 Resistor to Termination Pin, VT.
10 VREF_AC Output Voltage Reference for capacitorcoupled inputs, only.
11 VT
Internal 100 centertapped Termination Pin for IN and IN.
12 IN LVPECL, CML,
LVDS, HSTL
Noninverted Differential Clock Input. Internal 50 Resistor to Termination Pin, VT.
13 GND Negative Supply Voltage
14 V
CC
Positive Supply Voltage
15 Q0 LVPECL Output
Noninverted Differential Output. Typically Terminated with 50 Resistor to
V
CC
–2.0 V.
16 Q0 LVPECL Output
Inverted Differential Output. Typically Terminated with 50 Resistor to V
CC
–2.0 V.
EP The Exposed Pad (EP) on the QFN16 package bottom is thermally connected to the
die for improved heat transfer out of package. The exposed pad must be attached to
a heatsinking conduit. The pad is not electrically connected to the die, but is
recommended to be electrically and thermally connected to GND on the PC board.
1. In the differential configuration when the input termination pin VT, is connected to a common termination voltage or left open, and if no signal
is applied on IN/IN
inputs, then the device will be susceptible to selfoscillation.
NB6L14
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3
Table 3. ATTRIBUTES
Characteristics Value
ESD Protection Human Body Model
Machine Model
> 4 kV
> 100 V
Moisture Sensitivity (Note 2) QFN16 Level 1
Flammability Rating Oxygen Index: 28 to 34 UL 94 V0 @ 0.125 in
Transistor Count 167
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
2. For additional information, see Application Note AND8003/D.
Table 4. MAXIMUM RATINGS
Symbol Parameter Condition 1 Condition 2 Rating Unit
V
CC
Positive Power Supply GND = 0 V 4.0 V
V
Io
Positive Input/Output GND = 0 V 0.5 V v V
Io
v V
CC
+ 0.5 V 4.0 V
I
IN
Input Current
Source or Sink Current (IN/IN
)
"50 mA
I
VREF_AC
Source or Sink Current on VT Pin "2.0 mA
I
OUT
Output Current Continuous
Surge
50
100
mA
mA
T
A
Operating Temperature Range 40 to +85 °C
T
stg
Storage Temperature Range 65 to +150 °C
JA
Thermal Resistance
(JunctiontoAmbient) (Note 3)
0 lfpm
500 lfpm
QFN16
QFN16
42
35
°C/W
°C/W
JC
Thermal Resistance (JunctiontoCase) (Note 3) QFN16 4 °C/W
T
sol
Wave Solder PbFree 265 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
3. JEDEC standard multilayer board 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad.

NB6L14MNG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Clock Buffer 1:4 LVPECL FNOUT BUF
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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