LTC2600/LTC2610/LTC2620
13
2600fe
OPERATION
32-bit sequence. The 32-bit word is required for daisy-
chain operation, and is also available to accommodate
microprocessors which have a minimum word width of
16 bits (2 bytes).
Daisychain Operation
The serial output of the shift register appears at the SDO
pin. Data transferred to the device from the SDI input is
delayed 32 SCK rising edges before being output at the
next SCK falling edge.
The SDO output can be used to facilitate control of multiple
serial devices from a single 3-wire serial port (i.e., SCK,
SDI and CS/LD). Such a “daisychain” series is confi gured
by connecting SDO of each upstream device to SDI of the
next device in the chain. The shift registers of the devices
are thus connected in series, effectively forming a single
input shift register which extends through the entire
chain. Because of this, the devices can be addressed and
controlled individually by simply concatenating their input
words; the fi rst instruction addresses the last device in
the chain and so forth. The SCK and CS/LD signals are
common to all devices in the series.
In use, CS/LD is fi rst taken low. Then the concatenated
input data is transferred to the chain, using SDI of the
rst device as the data input. When the data transfer is
complete, CS/LD is taken high, completing the instruction
sequence for all devices simultaneously. A single device
can be controlled by using the no-operation command
(1111) for the other devices in the chain.
C3
COMMAND ADDRESS DATA (16 BITS)
C2
C1
C0
A3
A2
A1
A0
D13D14D15
D12
D11 D10 D9 D8
D7
D6
D5 D4 D3 D2 D1
D0
2600 TBL01
MSB
LSB
C3
COMMAND ADDRESS DATA (14 BITS + 2 DON’T-CARE BITS)
C2
C1
C0
A3
A2
A1
A0
D13
D12
D11 D10 D9 D8
D7
D6
D5 D4 D3 D2 D1
D0 X X
2600 TBL02
MSB
LSB
C3
COMMAND ADDRESS DATA (12 BITS + 4 DON’T-CARE BITS)
C2
C1
C0
A3
A2
A1
A0
D11 D10 D9 D8
D7
D6
D5 D4 D3 D2 D1
D0 X XXX
2600 TBL03
MSB
LSB
INPUT WORD (LTC2600)
INPUT WORD (LTC2610)
INPUT WORD (LTC2620)
LTC2600/LTC2610/LTC2620
14
2600fe
OPERATION
Power-Down Mode
For power-constrained applications, power-down mode
can be used to reduce the supply current whenever less
than eight outputs are needed. When in power-down, the
buffer amplifi ers and reference inputs are disabled, and
draw essentially zero current. The DAC outputs are put
into a high impedance state, and the output pins are pas-
sively pulled to ground through individual 90k resistors.
When all eight DACs are powered down, the master bias
generation circuit is also disabled. Input- and DAC-register
contents are not disturbed during power-down.
Any channel or combination of channels can be put into
power-down mode by using command 0100b in combi-
nation with the appropriate DAC address, (n). The 16-bit
data word is ignored. The supply and reference currents
are reduced by approximately 1/8 for each DAC powered
down; the effective resistance at REF (Pin 6) rises accord-
ingly, becoming a high impedance input (typically > 1GΩ)
when all eight DACs are powered down.
Normal operation can be resumed by executing any
command which includes a DAC update, as shown in
Table 1. The selected DAC is powered up as its voltage
output is updated.
There is an initial delay as the DAC powers up before it
begins its usual settling behavior. If less than eight DACs
are in a powered-down state prior to the update command,
the power-up delay is 5μs. If, on the other hand, all eight
DACs are powered down, then the master bias genera-
tion circuit is also disabled and must be restarted. In this
case, the power-up delay is greater: 12μs for V
CC
= 5V,
30μs for V
CC
= 3V.
Voltage Outputs
Each of the 8 rail-to-rail amplifi ers contained in these parts
has guaranteed load regulation when sourcing or sinking
up to 15mA at 5V (7.5mA at 3V).
Load regulation is a measure of the amplifi ers ability to
maintain the rated voltage accuracy over a wide range of
load conditions. The measured change in output voltage
per milliampere of forced load current change is expressed
in LSB/mA.
DC output impedance is equivalent to load regulation, and
may be derived from it by simply calculating a change in
units from LSB/mA to Ohms. The amplifi ers’ DC output
impedance is 0.025Ω when driving a load well away from
the rails.
When drawing a load current from either rail, the output
voltage headroom with respect to that rail is limited by
the 25Ω typical channel resistance of the output devices;
e.g., when sinking 1mA, the minimum output voltage =
25Ω • 1mA = 25mV. See the graph Headroom at Rails vs
Output Current in the Typical Performance Characteristics
section.
The amplifi ers are stable driving capacitive loads of up
to 1000pF.
Board Layout
The excellent load regulation and DC crosstalk performance
of these devices is achieved in part by keeping “signal”
and “power” grounds separated internally and by reducing
shared internal resistance to just 0.005Ω.
LTC2600/LTC2610/LTC2620
15
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The GND pin functions both as the node to which the refer-
ence and output voltages are referred and as a return path
for power currents in the device. Because of this, careful
thought should be given to the grounding scheme and
board layout in order to ensure rated performance.
The PC board should have separate areas for the analog
and digital sections of the circuit. This keeps digital signals
away from sensitive analog signals and facilitates the use
of separate digital and analog ground planes which have
minimal capacitive and resistive interaction with each
other.
Digital and analog ground planes should be joined at only
one point, establishing a system star ground as close to
the device’s ground pin as possible. Ideally, the analog
ground plane should be located on the component side of
the board, and should be allowed to run under the part to
shield it from noise. Analog ground should be a continuous
and uninterrupted plane, except for necessary lead pads
and vias, with signal traces on another layer.
The GND pin of the part should be connected to analog
ground. Resistance from the GND pin to system star
ground should be as low as possible. Resistance here will
add directly to the effective DC output impedance of the
device (typically 0.025Ω), and will degrade DC crosstalk.
Note that the LTC2600/LTC2610/LTC2620 are no more
susceptible to these effects than other parts of their type;
on the contrary, they allow layout-based performance
improvements to shine rather than limiting attainable
performance with excessive internal resistance.
Rail-to-Rail Output Considerations
In any rail-to-rail voltage output device, the output is limited
to voltages within the supply range.
Since the analog outputs of the device cannot go below
ground, they may limit for the lowest codes as shown
in Figure 3b. Similarly, limiting can occur near full scale
when the REF pin is tied to V
CC
. If V
REF
= V
CC
and the DAC
full-scale error (FSE) is positive, the output for the highest
codes limits at V
CC
as shown in Figure 3c. No full-scale
limiting can occur if V
REF
is less than V
CC
– FSE.
Offset and linearity are defi ned and tested over the region
of the DAC transfer function where no output limiting can
occur.
OPERATION

LTC2600CUFD#PBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Digital to Analog Converters - DAC Octal 16-bit Voltage Output DAC in 4x5 QFN
Lifecycle:
New from this manufacturer.
Delivery:
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