LTC2600/LTC2610/LTC2620
16
2600fe
OPERATION
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
C2 C1 C0 A3 A2 A1 A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0C3
CS/LD
SCK
SDI
COMMAND WORD ADDRESS WORD DATA WORD
24-BIT INPUT WORD
YYYY F02a
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24 25 26 27 28 29 30 31 32
C2 C1 C0 A3 A2 A1 A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0C3XXXXXXXX
CS/LD
SCK
SDI
COMMAND WORD ADDRESS WORD DATA WORD
DON’T CARE
C2 C1 C0 A3 A2 A1 A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0C3XXXXXXXX
SDO
CURRENT
32-BIT
INPUT WORD
YYYY F02b
PREVIOUS 32-BIT INPUT WORD
t
2
t
3
t
4
t
1
t
8
D15
17
SCK
SDI
SDO
PREVIOUS D14PREVIOUS D15
18
D14
Figure 2b. LTC2600 32-Bit Load Sequence (Required for Daisy-Chain Operation).
LTC2610 SDI/SDO Data Word: 14-Bit Input Code + 2 Don’t-Care Bits;
LTC2620 SDI/SDO Data Word: 12-Bit Input Code + 4 Don’t-Care Bits
Figure 2a. LTC2600 24-Bit Load Sequence (Minimum Input Word).
LTC2610 SDI Data Word: 14-Bit Input Code + 2 Don’t-Care Bits;
LTC2620 SDI Data Word: 12-Bit Input Code + 4 Don’t-Care Bits
LTC2600/LTC2610/LTC2620
17
2600fe
PACKAGE DESCRIPTION
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
OPERATION
Figure 3. Effects of Rail-to-Rail Operation On a DAC Transfer Curve. (a) Overall Transfer Function (b) Effect
of Negative Offset for Codes Near Zero-Scale (c) Effect of Positive Full-Scale Error for Codes Near Full Scale
2600 F03
INPUT CODE
(b)
OUTPUT
VOLTAGE
NEGATIVE
OFFSET
0V
32, 7680 65, 535
INPUT CODE
OUTPUT
VOLTAGE
(a)
V
REF
= V
CC
V
REF
= V
CC
(c)
INPUT CODE
OUTPUT
VOLTAGE
POSITIVE
FSE
GN16 (SSOP) 0204
12
3
4
5
6
7
8
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
16
15
14
13
.189 – .196*
(4.801 – 4.978)
12 11 10
9
.016 – .050
(0.406 – 1.270)
.015 ± .004
(0.38 ± 0.10)
×
45
°
0
°
– 8
°
TYP
.007 – .0098
(0.178 – 0.249)
.0532 – .0688
(1.35 – 1.75)
.008 – .012
(0.203 – 0.305)
TYP
.004 – .0098
(0.102 – 0.249)
.0250
(0.635)
BSC
.009
(0.229)
REF
.254 MIN
RECOMMENDED SOLDER PAD LAYOUT
.150 – .165
.0250 BSC.0165
±
.0015
.045
±
.005
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
INCHES
(MILLIMETERS)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
LTC2600/LTC2610/LTC2620
18
2600fe
PACKAGE DESCRIPTION
UFD Package
20-Lead Plastic QFN (4mm × 5mm)
(Reference LTC DWG # 05-08-1711 Rev B)
4.00 p 0.10
(2 SIDES)
1.50 REF
5.00 p 0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 p 0.10
19 20
1
2
BOTTOM VIEW—EXPOSED PAD
2.50 REF
0.75 p 0.05
R = 0.115
TYP
PIN 1 NOTCH
R = 0.20 OR
C = 0.35
0.25 p 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UFD20) QFN 0506 REV B
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 p0.05
0.25 p0.05
2.65 p 0.05
2.50 REF
4.10 p 0.05
5.50 p 0.05
1.50 REF
3.10 p 0.05
4.50 p 0.05
PACKAGE OUTLINE
R = 0.05 TYP
2.65 p 0.10
3.65 p 0.10
3.65 p 0.05
0.50 BSC

LTC2600CUFD#PBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Digital to Analog Converters - DAC Octal 16-bit Voltage Output DAC in 4x5 QFN
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union