IRF9540NS/L
Starting T
J
= 25°C, L = 7.1mH
R
G
= 25Ω, I
AS
= -11A. (See Figure 12)
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
Notes:
** When mounted on 1" square PCB (FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.
I
SD
≤ -11A, di/dt ≤ -470A/µs, V
DD
≤ V
(BR)DSS
,
T
J
≤ 175°C
Pulse width ≤ 300µs; duty cycle ≤ 2%.
Uses IRF9540N data and test conditions
Source-Drain Ratings and Characteristics
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage -100 V V
GS
= 0V, I
D
= -250µA
∆V
(BR)DSS
/∆T
J
Breakdown Voltage Temp. Coefficient -0.11 V/°C Reference to 25°C, I
D
= -1mA
R
DS(on)
Static Drain-to-Source On-Resistance 0.117 Ω V
GS
= -10V, I
D
= -11A
V
GS(th)
Gate Threshold Voltage -2.0 -4.0 V V
DS
= V
GS
, I
D
= -250µA
g
fs
Forward Transconductance 5.3 S V
DS
= -50V, I
D
= -11A
-25
µA
V
DS
= -100V, V
GS
= 0V
-250 V
DS
= -80V, V
GS
= 0V, T
J
= 150°C
Gate-to-Source Forward Leakage 100 V
GS
= 20V
Gate-to-Source Reverse Leakage -100
nA
V
GS
= -20V
Q
g
Total Gate Charge 97 I
D
= -11A
Q
gs
Gate-to-Source Charge 15 nC V
DS
= -80V
Q
gd
Gate-to-Drain ("Miller") Charge 51 V
GS
= -10V, See Fig. 6 and 13
t
d(on)
Turn-On Delay Time 15 V
DD
= -50V
t
r
Rise Time 67 I
D
= -11A
t
d(off)
Turn-Off Delay Time 51 R
G
= 5.1Ω
t
f
Fall Time 51 R
D
= 4.2Ω, See Fig. 10
Between lead,
and center of die contact
C
iss
Input Capacitance 1300 V
GS
= 0V
C
oss
Output Capacitance 400 pF V
DS
= -25V
C
rss
Reverse Transfer Capacitance 240 = 1.0MHz, See Fig. 5
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
I
GSS
ns
I
DSS
Drain-to-Source Leakage Current
nH
7.5
L
S
Internal Source Inductance
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode)
showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode)
p-n junction diode.
V
SD
Diode Forward Voltage -1.6 V T
J
= 25°C, I
S
= -11A, V
GS
= 0V
t
rr
Reverse Recovery Time 150 220 ns T
J
= 25°C, I
F
= -11A
Q
rr
Reverse Recovery Charge 830 1200 nC di/dt = -100A/µs
t
on
Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
A
S
D
G
-23
-76
