Spec No. JENF243J-9103A-01 P.6/10
MURATA MFG.CO., LTD
Reference
Only
Solder Resist
Chip Colil
Land
4.1
1.8 1.85
5.5
Product outline
Land outline
Orifice of solder resist
7.4
[mm]
2.0
[mm]
2.7
[mm]
1.2
[mm]
8.8 Specification of Outer Case
Above Outer Case size is typical. It depends on a quantity of an order.
9.
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment (6) Disaster prevention / crime prevention equipment
(2) Aerospace equipment
(7) Traffic signal equipment
(3) Undersea equipment
(8) Transportation equipment (trains, ships, etc.)
(4) Power plant control equipment
(9) Applications of similar complexity and /or reliability
(5) Medical equipment
requirements to the applications listed in the above
10. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10.1 Land pattern designing (Reflow Soldering)
Recommended land patterns for reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
(Land pattern for Reflow soldering) (Land pattern for Flow soldering)
(in mm)
10.2 Flux, Solder
Flux
・Use rosin-based flux.
・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion
value).
・Don’t use water-soluble flux.
Solder
・Use Sn-3.0Ag-0.5Cu solder.
・Standard thickness of solder paste : 100μm to 150μm
Reel
Outer Case
Dimensions
(mm)
Standard Reel
Quantity in
Outer Case
(Reel)
W D H
φ180mm 186 186 93 4
φ330mm 340 340 95 4
W
D
Label
H
