CY28339
Document #: 38-07507 Rev. *A Page 17 of 18
© Cypress Semiconductor Corporation, 2004. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
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Package Drawing and Dimensions
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All product and company names mentioned in this document may be the trademarks of their respective holders.
1.100[0.043]
0.051[0.002]
0.851[0.033]
SEATING
PLANE
124
0.508[0.020]
0.500[0.019]
7.950[0.313]
0.25[0.010]
6.198[0.244]
12.395[0.488]
8.255[0.325]
5.994[0.236]
0.950[0.037]
0.500[0.020]
BSC
12.598[0.496]
0.152[0.006]
0.762[0.030]
0°-8°
DIMENSIONS IN MM[INCHES] MIN.
MAX.
MAX.
0.170[0.006]
0.279[0.011]
GAUGE PLANE
0.20[0.008]
25 48
0.100[0.003]
0.200[0.008]
REFERENCE JEDEC MO-153
PACKAGE WEIGHT 0.33gms
PART #
Z4824 STANDARD PKG.
ZZ4824 LEAD FREE PKG.
48-lead (240-mil) TSSOP II Z4824
51-85059-*C
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