L
E2
A3
A1
A
TOP VIEW
D
E
EXPOSED
PAD
METAL
D2
BOTTOM VIEW
2 1
b
p
n
(NOTE 1)
EXPOSED
TIE BAR
PIN 1
(NOTE 2)
ID INDEX
AREA
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package may have one or more exposed tie bars at ends.
.031
.000
.055
.047
.008
.012
A3Contact Thickness
Exposed Pad Length
Exposed Pad Width
Overall Length
Overall Width
Contact Width
Contact Length
(Note 3)
(Note 3)
b
L
E2
D2
E
D
Number of Pins
Pitch
Overall Height
Standoff
Dimension Limits
Units
p
A1
A
n
MIN
0.20 REF..008 REF.
.010
.016
.059
.079 BSC
.118 BSC
.065
.012
.061
.020
.067
1.50
1.65
2.00 BSC
3.00 BSC
0.25
0.40
0.20
0.30
1.20
1.39
0.30
0.50
1.55
1.70
MIN
.020 BSC
.001
.035
NOM
INCHES
8
.039
.002
MAX
0.90
MILLIMETERS*
0.50 BSC
0.020.00
0.80
NOM
0.05
1.00
MAX
8
2. REF: Reference Dimension, usually without tolerance, for information purposes only.
1. BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Exposed pad varies according to die attach paddle size.
Drawing No. C04-123, Revised 05-05-05
*Controlling Parameter
See ASME Y14.5M
See ASME Y14.5M
JEDEC equivalent: M0-229
Notes:
For DFN samples, contact your Microchip Sales Office for availability..
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
