Spec No. JEFL243E-0007J-01 3/10
MURATA MFG.CO.,LTD
No. Item Specification Test Method
8.6 Bonding
Strength
No evidence of coming off glass-
epoxy substrate.
Products shall not be mechanical
damaged.
It shall be soldered on the substrate.
Applying Force(F) : 9.8N
Applying Time : 30±1seconds
8.7 Vibration Meet Table 1. It shall be soldered on the substrate.
Oscillation Frequency :10 to 55 to 10Hz for 1 minute
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of 3
mutually perpendicular directions. (Total 6 hours)
9.Environmental Performance (Products shall be soldered on the glass-epoxy substrate)
No. Item Specification Test Method
9.1 Temperature
Cycle
Meet Table 1. 1 Cycle
Step 1 -40°C(+0°C,-3°C) / 30(+3,-0) min
Step 2 Ordinary Temp. / within 3 min
Step 3 +85(+3°C,-0°C) / 30(+3,-0) min
Step 4 Ordinary Temp. / within 3 min
Total of 100 cycles.
Then measured after exposure in the room condition
for 4 to 48 hours.
9.2 Humidity Temperature : 40±2°C
Humidity : 90 to 95 % (RH)
Time : 1000 hours(+48 hours,-0 hours)
Then measured after exposure in the room condition
for 4 to 48 hours.
9.3 Heat life Temperature : 85±2°C
Test Voltage : 2 times for Rated Voltage
Time : 1000 hours(+48 hours,-0 hours)
Then measured after exposure in the room condition
for 4 to 48 hours. (ref. Item
10.)
9.4 Cold Resistance Temperature : -40± 2°C
Time : 1000 hours(+48 hours,-0 hours)
Then measured after exposure in the room condition
for 4 to 48 hours.
10. Terminal to be Tested.
When measuring and suppling the voltage,the following terminal is applied.
No. Item Terminal to be Tested
10.1 Common Mode Impedance
(Measurement Terminal)
10.2
Withstanding Voltage
(Measurement Terminal)
10.3 DC Resistance
(Measurement Terminal)
Insulation Resistance
(Measurement Terminal)
10.4
10.5 Heat Life (Supply Terminal)
Terminal
Terminal
Terminal
Terminal
Terminal
Terminal
Terminal
Terminal
Terminal
Terminal
1.6
(T/3 ~ T)
R:0.4
:0.8
F
Products
Substrate
(in mm)
Solder Volume
(T:Chip thickness)
Tip form