OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

DLP31SN121SL2L

P1-P3P4-P6P7-P9P10-P10
Spec No. JEFL243E-0007J-01 7/10
MURATA MFG.CO.,LTD
Pick- up nozzle
Support pin
P.C.B.
Product
16.5 Attention Regarding P.C.B. Design
< The Arrangement of Products >
P.C.B. shall be designed so that products are
far from the portion of perforation.
The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the
case of P.C.B. separation.
Products shall not be arranged on the line
of a series of holes when there are big
holes in P.C.B.
(Because the stress concentrate on the
line of holes.)
< Products Placing >
Support pins shall be set under P.C.B .
to prevent causing a warp to P.C.B.
during placing the products on the other
side of P.C.B.
< P.C.B. Separation >
P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
16.6 Standard Land Dimensions (Flow and Reflow)
16.7 Soldering
(1) Standard printing pattern of solder paste
Standard thickness of the solder paste should be 150 to200µm.
Use the solder paste printing pattern of the right pattern.
For the resist and copper foil pattern, use standard
land dimensions.
Use the Solder Sn-3.0Ag-0.5Cu for pattern printing.
(2) Soldering Conditions
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
On flow soldering (e.g. double wave soldering), use the product in consideration of the
conditions of solder, solder temperature and immersion time (melting time) because longer
soldering time may cause the corrosion of the electrode.
On dipping soldering, use the product in consideration of the conditions of solder,
solder temperature, flux, preheat and so on because de-wetting may be caused.
○
×
×
○
P.C.B.
Portion of
Perforation
Portion of
Perforation
Product
Product
P.C.B.
Hole
○
×
*(1)(2)(3)(4)Indicatesterminalnumber
Resist
Copper fo ilpattern
Nopattern
(in:mm)
0.7
0.6
1.0
(1) (2)
(4)
(3)
2.1
1.0
Spec No. JEFL243E-0007J-01 8/10
MURATA MFG.CO.,LTD
① Flow soldering profile
Standard Profile Limit Profile
Pre-heating 150℃、60s min.
Heating 250℃、4～6s 265±3℃、5s max.
Cycle of flow 2 times 2 times
② Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150～180°C 、90s±30s
Heating above 220°C、30s～60s above 230°C、60s max.
Peak temperature 245±3°C 260°C、10s
Cycle of reflow 2 times 2 times
(3) Printing of Adhesive
Adhesive amount shall be about 0.3mg per chip to obtain enough adhesive strength.
When the adhesive come into the land pattern, causing poor solderbility.
The adhesive position is as follows.
150
60ｓ min.
Time（ｓ）
265±3℃
Temp.
(℃)
Heating Time
Standard Profile
250℃
Limit Profile
Adhesive
Adhesive
150
90s±30s
Time（ｓ）
245±3℃
Tem
p
.
(℃)
220℃
30～60s
180
260℃/10s
230℃
60s max.
Limit Profile
Standard Profile
Spec No. JEFL243E-0007J-01 9/10
MURATA MFG.CO.,LTD
(4) Reworking with Soldering iron
The following conditions shall be strictly followed when using a soldering iron after
being mounted by flow or reflow soldering.
· Pre-heating: 150°C, 1 min · Soldering iron output: 30W max.
· Tip temperature: 350°C max. · Tip diameter:φ3mm max.
· Soldering time : 3(+1,-0) seconds. · Times : 2times max.
Notes : Do not touch the products directly with the soldering iron.
(5) Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Excessive solder volume may cause the failure of mechanical or electrical performance.
16.8 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol.)
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B..
Power : 20W/ l max.
Frequency : 28kHz to 40kHz
Time : 5 minutes max.
(3) Cleaner
1. Alternative cleaner Isopropyl alcohol (IPA)
2. Aqueous agent PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning
Please contact us.
16.9 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
16.10 Operating Environment
Do not use this product under the following environmental conditions, on deterioration
of the performance, such as insulation resistance may result from the use.
(1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
U
pp
er Limit
U
pp
er Limit
Recommendable
Recommendable
1/3 T ≦ ｔ ≦ T （T : Chip thickness）
t
P1-P3P4-P6P7-P9P10-P10

DLP31SN121SL2L

Mfr. #:
Buy DLP31SN121SL2L
Manufacturer:
Description:
CMC 100MA 2LN 120 OHM SMD
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet