DLP31SN551SL2L Datasheet DLP31SN551ML2L, DLP31SN121ML2L, DLP31SN221ML2L | P1-P3

Spec No. JEFL243E-0007J-01 1/10

MURATA MFG.CO.,LTD

Chip Common Mode Choke Coil

DLP31SN□□□ML2□ Reference Specification

1.Scope

This reference specification applies to Chip Common Mode Choke Coil DLP31SN_ML Series.

2.Part Numbering

(ex.) DL P 31 S N 551 M L 2 L

(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)

(1) Chip Common Mode Choke Coil

(2) Structure (P : Film Type)

(3) Dimension (LW)

(4) Type

(5) Category

3.Rating

Customer

Part Number

Murata

Part Number

Common Mode Impedance

(at 100MHz, Under

Standard Testing Condition)

Rated

Voltage

Withstanding

Voltage

Rated

Current

Resistance

Insulation

Resistance

DLP31SN121ML2L

120±20%

16V(DC) 40V(DC) 100mA

2.0max

100Mmin.

DLP31SN121ML2B

DLP31SN221ML2L

220±20% 2.5max

DLP31SN221ML2B

DLP31SN551ML2L

550±20% 3.6max

DLP31SN551ML2B

Operating Temperature : -40 to +85°C Storage Temperature : -40 to +85°C

4. Standard Testing Conditions

Unless otherwise specified> <In case of doubt>

Temperature : Ordinary Temperature 15 to 35°C Temperature : 20 ± 2°C

Humidity : Ordinary Humidity 25 to 85%(RH) Humidity : 60 to 70%(RH)

Atmospheric Pressure : 86 to106kPa

5.Style and Dimensions

■ Equivalent Circuits

■ Unit Mass (Typical value)

0.030g

6.Marking

No Marking.

Reference Only

(1)

(4)

(2)

(3)

No polarity

(6) Impedance (Typ. at 100MHz)

(7) Circuit

(8) Features

(9) Number of Line

(10) Packaging Code L : Taping / B : Bulk

1.15±0.15

(TopView)

(BottomView)

(SideView)

1.60±0.15

0.30±0.20

3.20±0.15

(2.10)

(1) (2)

(3)(4)

:Electrode

(in:mm)

0.70±0.20

(Ref erenceValue)

Spec No. JEFL243E-0007J-01 2/10

MURATA MFG.CO.,LTD

7. Electrical Performance

No. Item Specification Test Method

7.1 Common Mode

Impedance

Meet item 3. Measuring Frequency : 100±1MHz (ref.item 10.)

Measuring Equipment : Agilent 4291A or the

equivalents

(In case of doubt in standard condition, the heat

treatment (200°C, about 10 minutes)shall be applied.

7.2 Withstanding

Voltage

Products shall not be damaged. Test Voltage : 2.5 times for Rated Voltage

Time : 1 to 5 seconds

Charge Current : 1 mA max.(ref.item 10.)

7.3 DC Resistance

(Rdc)

Meet item 3. Measuring current : 100mA max.(ref.item 10.)

7.4 Insulation

Resistance (I.R.)

Measuring voltage : Rated Voltage

Measuring time : 1 minute max. (ref.item 10.)

8.Mecanical Performance

No. Item Specification Test Method

8.1 Appearance and

Dimensions

Meet item 5.

Visual Inspection and measured with Slide Calipers.

8.2 Solderability The electrodes shall be at least

95% covered with new solder

coating.

Flux : Ethanol solution of rosin,25(wt)%

Pre-Heating : 150°C, 1minute

Solder : Sn-3.0Ag-0.5Cu

Solder Temperature : 245±5°C

Immersion Time : 3±1 seconds

Immersion and emersion rates : 25 mm / s

8.3 Resistance to

Soldering Heat

Meet Table 1.

Table 1

Flux : Ethanol solution of rosin,25(wt)%

Pre-Heating : 150°C ,1minute

Solder : Sn-3.0Ag-0.5Cu

Solder Temperature : 270±5°C

Immersion Time : 10±0.5 seconds

Immersion and emersion rates : 25 mm / s

Then measured arter exposure in the room condition

for 4 to 48 hours.

8.4 Bending

Strength

Substrate : (t =1.6 mm).

Deflection : 2 mm

Speed of Applying Force : 0.5 mm / s

Keeping time : 30 seconds

8.5 Drop

Products shall be no failure. It shall be dropped on concrete or steel board.

Method : free fall

Height : 75 cm

Attitude from which the product is dropped

:3 directions

The Number of Times

:3 times for each direction (Total 9 times)

Ｒｄｃ

Appearance No damaged

Common Mode

Impedance

Change

within ± 20%

I.R.

100MΩ min.

DC Resistance

Change

within ± 30%

R230

Deflection

Product

Pressure jig

Spec No. JEFL243E-0007J-01 3/10

MURATA MFG.CO.,LTD

No. Item Specification Test Method

8.6 Bonding

Strength

No evidence of coming off glass-

epoxy substrate.

Products shall not be mechanical

damaged.

It shall be soldered on the substrate.

Applying Force(F) : 9.8N

Applying Time : 30±1seconds

8.7 Vibration Meet Table 1. It shall be soldered on the substrate.

Oscillation Frequency :10 to 55 to 10Hz for 1 minute

Total Amplitude : 1.5mm

Testing Time : A period of 2 hours in each of 3

mutually perpendicular directions. (Total 6 hours)

9.Environmental Performance (Products shall be soldered on the glass-epoxy substrate)

No. Item Specification Test Method

9.1 Temperature

Cycle

Meet Table 1. 1 Cycle

Step 1 -40°C(+0°C,-3°C) / 30(+3,-0) min

Step 2 Ordinary Temp. / within 3 min

Step 3 +85(+3°C,-0°C) / 30(+3,-0) min

Step 4 Ordinary Temp. / within 3 min

Total of 100 cycles.

Then measured after exposure in the room condition

for 4 to 48 hours.

9.2 Humidity Temperature : 40±2°C

Humidity : 90 to 95 % (RH)

Time : 1000 hours(+48 hours,-0 hours)

Then measured after exposure in the room condition

for 4 to 48 hours.

9.3 Heat life Temperature : 85±2°C

Test Voltage : 2 times for Rated Voltage

Time : 1000 hours(+48 hours,-0 hours)

Then measured after exposure in the room condition

for 4 to 48 hours. (ref. Item

10.)

9.4 Cold Resistance Temperature : -40± 2°C

Time : 1000 hours(+48 hours,-0 hours)

Then measured after exposure in the room condition

for 4 to 48 hours.

10. Terminal to be Tested.

When measuring and suppling the voltage,the following terminal is applied.

No. Item Terminal to be Tested

10.1 Common Mode Impedance

(Measurement Terminal)

10.2

Withstanding Voltage

(Measurement Terminal)

10.3 DC Resistance

(Measurement Terminal)

Insulation Resistance

(Measurement Terminal)

10.4

10.5 Heat Life (Supply Terminal)

Terminal

1.6

(T/3 ~ T)

R:0.4



:0.8

Products

Substrate

(in mm)

Solder Volume

(T:Chip thickness)

Tip form

P1-P3 P4-P6 P7-P9 P10-P10

DLP31SN551SL2L

Mfr. #:

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DLP31SN551SL2L

DLP31SN551SL2L

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