Spec No. JEFL243E-0007J-01 6/10
MURATA MFG.CO.,LTD
15. △
!
Caution
15.1 Mounting Direction
Mount products in right direction.
Wrong direction which is 90°rotated from right direction causes not only open or short circuit but also
flames or other serious trouble.
15.2 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life, body
or property.
(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment (8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10)Applications of similar complexity and /or reliability requirements
to the applications listed in the above
16. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
16.1 Flux and Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder.
Use of Sn-Zn based solder will deteriorate performance of products.
In case of using Sn-Zn based solder, please contact Murata in advance.
16.2 Assembling
<Thermal Shock>
Pre-heating should be in such a way that the temperature difference between solder and
ceramic surface is limited to 100°C MAX. Also cooling into solvent after soldering
should be in such a way that the temperature difference is limited to 100°C max.
16.3 Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In
prior to use, please make the reliability evaluation with the product mounted in your application set.
16.4 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
［Products direction］
Products shall be location the sideways
Direction (Length : a<b) to the mechanical
Stress.
(2)Products location on P.C.B. separation
Products(A,B,C,D) shall be located carefully
so that products are not subject to the
mechanical stress due to warping the board.
Because they may be subjected the mechanical
stress in order of A
CB D.
〈
Poor example
〉
〈
Good example
〉
b
a
Seam
Slit
A
D
B
C
b
a
Length:a
b
Z Z
wrong direction
right direction
