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4
Table 4. DC CHARACTERISTICS, CLOCK Inputs, CML Outputs V
CC
= 3.0 V to 3.6 V, V
EE
= 0 V, T
A
= 40°C to +85°C
Symbol
Characteristic Min Typ Max Unit
I
CC
Power Supply Current (Inputs and Outputs Open) 25 35 mA
R
L
= 50 W, V
TT
= 3.6 V to 2.5 V
V
OH
Output HIGH Voltage (Note 3) V
TT
60 V
TT
10 V
TT
mV
V
OL
Output LOW Voltage (Note 3) V
TT
1100 V
TT
800 V
TT
640 mV
|V
OD
| Differential Output Voltage Magnitude 640 780 1000 mV
R
L
= 25 W, V
TT
= 3.6 V to 2.5 V $5%
V
OH
Output HIGH Voltage (Note 3) V
TT
60 V
TT
10 V
TT
mV
V
OL
Output LOW Voltage (Note 3) V
TT
550 V
TT
400 V
TT
320 mV
|V
OD
| Differential Output Voltage Magnitude 320 390 500 mV
R
L
= 50 W, V
TT
= 1.8 V $5%
V
OH
Output HIGH Voltage (Note 3) V
TT
170 V
TT
10 V
TT
mV
V
OL
Output LOW Voltage (Note 3) V
TT
1100 V
TT
800 V
TT
640 mV
|V
OD
| Differential Output Voltage Magnitude 570 780 1000 mV
R
L
= 25 W, V
TT
= 1.8 V $5%
V
OH
Output HIGH Voltage (Note 3) V
TT
85 V
TT
10 V
TT
mV
V
OL
Output LOW Voltage (Note 3) V
TT
500 V
TT
400 V
TT
320 mV
|V
OD
| Differential Output Voltage Magnitude 285 390 500 mV
DIFFERENTIAL INPUT DRIVEN SINGLEENDED (Figures 14 and 16)
V
th
Input Threshold Reference Voltage Range (Note 5) V
EE
V
CC
mV
V
IH
Singleended Input HIGH Voltage V
th
+ 100 V
CC
+ 400 mV
V
IL
Singleended Input LOW Voltage V
EE
400 V
th
100 mV
DIFFERENTIAL INPUTS DRIVEN DIFFERENTIALLY (Figures 15 and 17)
V
IHD
Differential Input HIGH Voltage V
EE
V
CC
+ 400 mV
V
ILD
Differential Input LOW Voltage V
EE
400 V
CC
100 mV
V
CMR
Input Common Mode Range (Differential Configuration) V
EE
V
CC
mV
|V
ID
| Differential Input Voltage Magnitude (|V
IHD
V
ILD
|) (Note 7) 100 V
CC
V
EE
mV
C
IN
Input Capacitance (Note 7) 1.5 pF
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
3. CML outputs require R
L
receiver termination resistors to V
TT
for proper operation. Outputs must be connected through R
L
to V
TT
at power
up. The output parameters vary 1:1 with V
TT
.
4. Input parameters vary 1:1 with V
CC
.
5. V
th
is applied to the complementary input when operating in singleended mode.
6. V
CMR
(MIN) varies 1:1 with V
EE
, V
CMR
max varies 1:1 with V
CC
.
7. Parameter guaranteed by design and evaluation but not tested in production.
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5
Table 5. AC CHARACTERISTICS V
CC
= 3.0 V to 3.6 V, V
EE
= 0 V; (Note 8)
Symbol
Characteristic
40°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
V
OUTPP
Output Voltage Amplitude (R
L
= 50 W)
f
in
1 GHz
(See Figure 12) f
in
1.5 GHz
f
in
2.5GHz
550
400
150
660
640
400
550
400
150
660
640
400
550
400
150
660
640
400
mV
V
OUTPP
Output Voltage Amplitude (R
L
= 25 W)
f
in
1 GHz
(See Figure 12) f
in
1.5 GHz
f
in
2.5GHz
280
280
100
370
360
300
280
280
100
370
360
400
280
280
100
370
360
400
mV
f
DATA
Maximum Operating Data Rate 1.5 2.5 1.5 2.5 1.5 2.5 Gb/s
t
PLH
,
t
PHL
Propagation Delay to Output Differential
@ 0.5 GHz
300 420 600 300 420 600 300 420 600 ps
t
SKEW
Duty Cycle Skew (Note 9)
Within Device Skew
Device to Device Skew (Note 13)
2
5
20
20
25
100
2
5
20
20
25
100
2
5
20
20
25
100
ps
t
JITTER
RMS Random Clock Jitter R
L
= 50 W and
R
L
= 25 W (Note 11) f
in
= 750 MHz
f
in
= 1.5 GHz
f
in
= 2.5 GHz
PeaktoPeak Data Dependent Jitter R
L
= 50 W
f
DATA
= 1.5 Gb/s
(Note 12) f
DATA
= 2.5 Gb/s
PeaktoPeak Data Dependent Jitter R
L
= 25 W
f
DATA
= 1.5 Gb/s
(Note 12) f
DATA
= 2.5 Gb/s
1
1
1
15
20
5
10
3
3
3
55
85
35
35
1
1
1
15
20
5
10
3
3
3
55
85
35
35
1
1
1
15
20
5
10
3
3
3
55
85
35
35
ps
V
INPP
Input Voltage Swing/Sensitivity
(Differential Configuration) (Note 10)
100 100 100 mV
t
r
t
f
Output Rise/Fall Times @ 0.5 GHz Q, Q
(20% 80%)
150 300 150 300 150 300 ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
8. Measured by forcing V
INPP
(MIN) from a 50% duty cycle clock source. All output loaded with an external R
L
= 50 W and R
L
= 25 W to V
TT
.
Outputs must be connected through R
L
to V
TT
at power up. Input edge rates 150 ps (20% 80%).
9. Duty cycle skew is measured between differential outputs using the deviations of the sum of T
pw
and T
pw+
@ 0.5 GHz.
10.V
INPP
(MAX) cannot exceed V
CC
V
EE
. Input voltage swing is a singleended measurement operating in differential mode.
11. Additive RMS jitter with 50% duty cycle clock signal.
12.Additive peaktopeak data dependent jitter with input NRZ data signal (PRBS 2
23
1).
13.Device to device skew is measured between outputs under identical transition @ 0.5 GHz.
Figure 3. Output Voltage Amplitude (V
OUTPP
) versus Input Clock Frequency (f
IN
) at Ambient Temperature (Typical)
0
100
200
300
400
500
600
700
800
0.75 1 1.25 1.5 1.75 2 2.25 2.5 2.75 3
R
L
= 50 W
R
L
= 25 W
INPUT CLOCK FREQUENCY (GHz)
OUTPUT VOLTAGE AMPLITUDE (mV)
(V
CC
V
EE
= 3.3 V V
TT
= 3.3 V @ 255C V
in
= 100 mV)
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.75 1 1.25 1.5 1.75 2 2.25 2.5 2.75 3
INPUT CLOCK FREQUENCY (GHz)
OUTPUT VOLTAGE AMPLITUDE (mV)
(V
CC
V
EE
= 3.0 V V
TT
= 1.71 V @255C V
in
= 100 mV)
R
L
= 50 W
R
L
= 25 W
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6
NB4N11M
0
10
20
30
40
50
60
70
80
0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5 2.75 3
40°C
25°C
85°C
INPUT CLOCK FREQUENCY (GHz)
TIME (ps)
Figure 4. Data Dependent Jitter vs. Frequency
and Temperature (V
CC
V
EE
= 3.3 V; V
TT
= 3.3 V
@ 255C; V
IN
= 100 mV; PRBS 2
23
1; R
L
= 50 W)
0
5
10
15
20
25
30
35
0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5 2.75 3
25°C
40°C
85°C
INPUT CLOCK FREQUENCY (GHz)
TIME (ps)
Figure 5. Data Dependent Jitter vs. Frequency
and Temperature (V
CC
V
EE
= 3.3 V; V
TT
= 3.3 V
@ 255C; V
IN
= 100 mV; PRBS 2
23
1; R
L
= 25 W)
300
350
400
450
500
550
600
40 25 85
Figure 6. Typical Propagation Delay vs.
Temperature (V
CC
V
EE
= 3.3 V; V
TT
= 3.3 V
@ 255C; V
in
= 100 mV; R
L
= 50 W)
TEMPERATURE (°C)
TIME (ps)
t
PD
Figure 7. Typical Propagation Delay vs. Input
Offset Voltage (V
CC
V
EE
= 3.3 V; V
TT
= 3.3 V
@ 255C; V
in
= 100 mV R
L
= 50 W)
300
350
400
450
500
550
600
t
PD
INPUT OFFSET VOLTAGE (V)
TIME (ps)
V
EE
0.5 V V
CC
+ 0.5 V
V
CC
* V
EE
2
Figure 8. Supply Current vs. Temperature
0
5
10
15
20
25
30
35
40 25 85
I
CC
TEMPERATURE (°C)
CURRENT (mA)

NB4N11MDTG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Clock Buffer MLTLVL IN-CML RECBUF
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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