XC9572XV-7PC44C

DS052 (v3.0) June 25, 2007 www.xilinx.com 1
Product Specification
© 2006, 2007 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
Note: This product is being discontinued. You cannot
order parts after May 14, 2008. Xilinx recommends replac-
ing XC9572XV devices with equivalent XC9572XL devices
in all designs as soon as possible. Recommended replace-
ments are pin compatible, however require a V
CC
change to
3.3V, and a recompile of the design file. In addition, there is
no 1.8V I/O support. See XCN07010
for details regarding
this discontinuation, including device replacement
recomendations for the XC9572XV CPLD.
Features
72 macrocells with 1,600 usable gates
Available in small footprint packages
- 44-pin VQFP (34 user I/O pins)
- 100-pin TQFP (72-user I/O pins)
Optimized for high-performance 2.5V systems
- Low power operation
- Multi-voltage operation
Advanced system features
- In-system programmable
- Superior pin-locking and routability with
Fast CONNECT™ II switch matrix
- Extra wide 54-input Function Blocks
- Up to 90 product-terms per macrocell with
individual product-term allocation
- Local clock inversion with three global and one
product-term clocks
- Individual output enable per output pin
- Input hysteresis on all user and boundary-scan pin
inputs
- Bus-hold ciruitry on all user pin inputs
- Full IEEE Standard 1149.1 boundary-scan (JTAG)
Fast concurrent programming
Slew rate control on individual outputs
Enhanced data security features
Excellent quality and reliability
- 20 year data retention
- ESD protection exceeding 2,000V
Description
The XC9572XV is a 2.5V CPLD targeted for high-perfor-
mance, low-voltage applications in leading-edge communi-
cations and computing systems. It is comprised of four
54V18 Function Blocks, providing 1,600 usable gates with
propagation delays of 5 ns.
Power Estimation
Power dissipation in CPLDs can vary substantially depend-
ing on the system frequency, design application and output
loading. To help reduce power dissipation, each macrocell
in a XC9500XV device may be configured for low-power
mode (from the default high-performance mode). In addi-
tion, unused product-terms and macrocells are automati-
cally deactivated by the software to further conserve power.
For a general estimate of I
CC
, the following equation may be
used:
P
TOTAL
= P
INT
+ P
IO
= I
CCINT
x V
CCINT
+ P
IO
Separating internal and I/O power here is convenient
because XC9500XV CPLDs also separate the correspond-
ing power pins. P
IO
is a strong function of the load capaci-
tance driven, so it is handled by I = CVf. I
CCINT
is another
situation that reflects the actual design considered and the
internal switching speeds. An estimation expression for
I
CCINT
(taken from simulation) is:
I
CCINT
(mA) = MC
HS
(0.122 X PT
HS
+ 0.238) + MC
LP
(0.042 x
PT
LP
+ 0.171) + 0.04(MC
HS
+ MC
LP
) x f
MAX
x MC
TOG
where:
MC
HS
= # macrocells used in high speed mode
MC
LP
= #macrocells used in low power mode
PT
HS
= average p-terms used per high speed macrocell
PT
LP
= average p-terms used over low power macrocell
f
MAX
= max clocking frequency in the device
MC
TOG
= % macrocells toggling on each clock (12% is
frequently a good estimate
This calculation was derived from laboratory measurements
of an XC9500XV part filled with 16-bit counters and allowing
a single output (the LSB) to be enabled. The actual I
CC
value varies with the design application and should be veri-
fied during normal system operation. Figure 1 shows the
above estimation in a graphical form. For a more detailed
discussion of power consumption in this device, see Xilinx
application note XAPP361, “Planning for High Speed
XC9500XV Designs.”
0
XC9572XV High-performance
CPLD
DS052 (v3.0) June 25, 2007
05
Product Specification
R
C
lo
ck
F
r
e
qu
e
n
cy
(
M
H
z
)
T
y
pi
ca
l
I
CC
(
m
A
)
0 100 200
DS052_01_041405
30
50
LowPower
15050
10
70
90
110
High Performance
Product Obsolete/Under Obsolescence
XC9572XV High-performance CPLD
2 www.xilinx.com DS052 (v3.0) June 25, 2007
Product Specification
R
Figure 1: Typical ICC vs. Frequency for XC9572XV
Figure 2: XC9572XV Architecture (Function Block outputs (indicated by the bold line) drive the I/O Blocks directly)
Supported I/O Standards
The XC9572XV CPLD features both LVCMOS and LVTTL
I/O implementations. See Table 1 for I/O standard voltages.
The LVTTL I/O standard is a general purpose EIA/JEDEC
standard for 3.3V applications that use an LVTTL input
buffer and Push-Pull output buffer. The LVCMOS2 standard
is used in 2.5V applications.
XC9500XV CPLDs are also 1.8V I/O compatible. The
X25TO18 setting is provided for generating 1.8V compatible
outputs from a CPLD normally operating in a 2.5V environ-
ment. The default I/O Standard for pads without IOSTAN-
DARD attributes is LVTTL for XC9500XV devices.
In-System Programming Controller
JTAG
Controller
I/O
Blocks
Function
Block 1
Macrocells
1 to 18
Macrocells
1 to 18
Macrocells
1 to 18
Macrocells
1 to 18
JTAG Port
3
54
I/O/GTS
I/O/GSR
I/O/GCK
I/O
I/O
I/O
I/O
2
1
I/O
I/O
I/O
I/O
3
DS052_02_041200
1
Function
Block 2
54
Function
Block 3
54
Function
Block 4
54
18
18
18
18
Fas t CONNECT II Switch Matrix
Table 1: IOSTANDARD Options
IOSTANDARD V
CCIO
LVTTL 3.3V
LVCMOS2 2.5V
X25TO18 1.8V
Product Obsolete/Under Obsolescence
XC9572XV High-performance CPLD
DS052 (v3.0) June 25, 2007 www.xilinx.com 3
Product Specification
R
Absolute Maximum Ratings
Recommended Operation Conditions
Quality and Reliability Characteristics
Symbol Description Value Units
V
CC
Supply voltage relative to GND –0.5 to 2.7 V
V
CCIO
Supply voltage for output drivers –0.5 to 3.6 V
V
IN
Input voltage relative to GND
(1)
–0.5 to 3.6 V
V
TS
Voltage applied to 3-state output
(1)
–0.5 to 3.6 V
T
STG
Storage temperature (ambient) –65 to +150
o
C
T
J
Junction temperature +150
o
C
Notes:
1. Maximum DC undershoot below GND must be limited to either 0.5V or 10 mA, whichever is easier to achieve. During transitions, the
device pins may undershoot to –2.0V or overshoot to +3.6V, provided this over- or undershoot lasts less than 10 ns and with the
forcing current being limited to 200 mA.
2. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
3. For solder specifications, see Xilinx Packaging
.
Symbol Parameter Min Max Units
V
CCINT
Supply voltage for internal logic
and input buffers
Commercial T
A
= 0
o
C to +70
o
C 2.37 2.62 V
Industrial T
A
= –40
o
C to +85
o
C 2.37 2.62
V
CCIO
Supply voltage for output drivers for 3.3V operation 3.0 3.6 V
Supply voltage for output drivers for 2.5V operation 2.37 2.62 V
Supply voltage for output drivers for 1.8V operation 1.71 1.89 V
V
IL
Low-level input voltage 0 0.8 V
V
IH
High-level input voltage 1.7 3.6 V
V
O
Output voltage 0 V
CCIO
V
Symbol Parameter Min Max Units
T
DR
Data retention 20 - Years
N
PE
Program/Erase cycles (endurance) 1,000 - Cycles
V
ESD
Electrostatic Discharge (ESD) 2,000 - Volts
Product Obsolete/Under Obsolescence

XC9572XV-7PC44C

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Xilinx
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