T1235T-6I

Characteristics T12T
4/8 DocID16487 Rev3
Table 5. Thermal resistance
Symbol Parameter Value Unit
R
th(j-c)
Junction to case (AC) 2.6 °C/W
R
th(j-a)
Junction to ambient (DC) 60 °C/W
Figure 1. Maximum power dissipation versus
rms on-state current (full cycle)
Figure 2. On-state rms current versus case
temperature (full cycle)
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
0123456789101112
P(W
)
180°
I
T(RMS)
(A)
α=180
°
0
1
2
3
4
5
6
7
8
9
10
11
12
13
0 25 50 75 100 125
I
T(RMS)
(A)
α=180°
T
C
(°C)
Figure 3. On-state rms current versus ambient
temperature
Figure 4. Relative variation of thermal
impedance versus pulse duration
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 25 50 75 100 125
I
T(RMS)
(A)
α=180°
T
a
(°C)
1.0E -02
1.0E -01
1.0E+00
1.0E -03 1.0E -02 1.0E -01 1.0E+00 1.0E+01 1.0E+02 1.0E+03
K=[Z
th
/R
th
]
Z
th(j-c)
Z
th(j-a)
t
P
(s)
Figure 5. On state characteristics (maximum
values)
Figure 6. Surge peak on state current versus
number of cycles
1
10
100
012345
I
TM
(A)
T
j
=25 °C
T
j
=125 °C
T
j
max :
V
to
= 0.85 V
R
d
= 35 mΩ
V
TM
(V)
0
10
20
30
40
50
60
70
80
90
100
1 10 100 1000
I
TSM
(A)
Repetitive
T
C
=88 °C
One cycle
t=20ms
Number of cycles
j
Non repetitive
T initial=25°C
DocID16487 Rev3 5/8
T12T Characteristics
8
Figure 7. Non repetitive surge peak on state
current for a sinusoidal
Figure 8. Relative variation of gate trigger
current and gate trigger voltage versus junction
temperature
10
100
1000
0.01 0.10 1.00 10.00
I
TSM
(A), I²t (A²s)
T
j
initial=25°C
dI/dt limitation: 50 A/µs
I
TSM
I²t
t
P
(ms)
pulse with width t < 10 ms and corresponding value of I T
p
2
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-50 -25 0 25 50 75 100 125
I
GT
,V
GT
[T
j
]/I
GT
,V
GT
[T
j
=25 °C]
V
GT
Q1-Q2-Q3
GT
IQ3
I
GT
Q1-Q2
T
j
(°C)
typical values
Figure 9. Relative variation of holding current
and latching current versus junction
temperature
Figure 10. Relative variation of critical rate of
decrease of main current versus (dV/dt)c
0.0
0.5
1.0
1.5
2.0
2.5
-50 -25 0 25 50 75 100 125
I
H
,I
L
[T
j
]/I
H
,I
L
[T
j
=25 °C]
0.0
0.5
1.0
1.5
2.0
2.5
-50 -25 0 25 50 75 100 125
I
H
,I
L
[T
j
]/I
H
,I
L
[T
j
=25 °C]
I
L
I
H
T
j
(°C)T
j
(°C)
typical values
0
1
2
3
4
5
6
7
25 50 75 100 125
dV/dt [T
j
]/dV/dt[T
j
=125 °C]
V
D
=V
R
=402 V
T
j
(°C)
typical values
Logic Level and Snubberless types
Figure 11. Relative variation of critical rate of
decrease of main current versus junction
temperature
Figure 12. Leakage current versus junction
temperature for different values of blocking
voltage (typical values)
0
1
2
3
4
5
6
7
8
25 50 75 100 125
T
j
(°C)
(dI/dt)
C
[T
j
]/(dI/dt)
c
[T
j
=125 °C]
1.0E-03
1.0E-02
1.0E-01
1.0E+00
25 50 75 100 125
T
j
(°C)
I
DRM
/I
RRM
[Tj;V
DRM/
V
RRM
]/I
DRM
/I
RRM
[Tj=12C;7 00V]
V
DRM
=V
RRM
=400 V
V
DRM
=V
RRM
=600 V
V
DRM
=V
RRM
=600 V
V
DRM
=200 V
RRM
=V
Package information T12T
6/8 DocID16487 Rev3
2 Package information
Epoxy meets UL94, V0
Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Table 6. TO-220AB insulated dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 15.20 15.90 0.598 0.625
a1 3.75 0.147
a2 13.00 14.00 0.511 0.551
B 10.00 10.40 0.393 0.409
b1 0.61 0.88 0.024 0.034
b2 1.23 1.32 0.048 0.051
C 4.40 4.60 0.173 0.181
c1 0.49 0.70 0.019 0.027
c2 2.40 2.72 0.094 0.107
e 2.40 2.70 0.094 0.106
F 6.20 6.60 0.244 0.259
ØI 3.75 3.85 0.147 0.151
I4 15.80 16.40 16.80 0.622 0.646 0.661
L 2.65 2.95 0.104 0.116
l2 1.14 1.70 0.044 0.066
l3 1.14 1.70 0.044 0.066
M 2.60 0.102
C
b2
c2
F
Ø I
L
A
a1
a2
B
e
b1
I4
l3
l2
c1
M

T1235T-6I

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Triacs Snubless logic level standard 12 A TRIACs
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet