©2014 DS70005041D 08/14
4
2.4 GHz High-Gain, High-Efficiency Power Amplifier
SST12LP19E
Data Sheet
Pin Assignments
Figure 3: Pin Assignments
1423 F3b.0
VCC1
VCCb VREF
RFIN
VCC2/RFOUT
DET
3
2
1
4
5
6
Top View
RF & DC
Ground
0
(Contacts facing
down)
8-Contact XSON
6-Contact XSON and 6-Contact X2SON
4
3
2
1
5
6
7
8
VCC1
VCCb
VREF
RFIN
RFOUT
RFOUT
VCC2
Top View
RF & DC
Ground
0
(Contacts
facing down)
DET
1423 F3a.0
©2014 DS70005041D 08/14
5
2.4 GHz High-Gain, High-Efficiency Power Amplifier
SST12LP19E
Data Sheet
Pin Descriptions
Table 1: Pin Description, 8-contact XSON (QX8)
Symbol Pin No. Pin Name Type
1
1. I=Input, O=Output
Function
GND 0 Ground Low inductance ground pad
V
CC1
1 Power Supply PWR Power supply, 1
st
stage
RF
IN
2 I RF input, DC decoupled
V
CCb
3 Power Supply PWR Supply voltage for bias circuit
VREF 4 PWR 1
st
and 2
nd
stage idle current control
Det 5 O On-chip power detector
RFOUT 6 O RF output
RFOUT 7 O RF output
V
CC2
8 Power Supply PWR Power supply, 2
nd
stage
T1.0 75041
Table 2: Pin Description, 6-contact XSON (QX6) and 6-contact X2SON(NR)
Symbol Pin No. Pin Name Type
1
1. I=Input, O=Output
Function
GND 0 Ground Low inductance ground pad
V
CC1
1 Power Supply PWR Power supply, 1
st
stage
RF
IN
2 I RF input, DC decoupled
V
CCb
3 Power Supply PWR Supply voltage for bias circuit
VREF 4 PWR 1
st
and 2
nd
stage idle current control
Det 5 O On-chip power detector
V
CC2
/ RFOUT 6 Power Supply PWR/O Power supply, 2
nd
stage/ RF Output
T2.0 75041
©2014 DS70005041D 08/14
6
2.4 GHz High-Gain, High-Efficiency Power Amplifier
SST12LP19E
Data Sheet
Electrical Specifications
The RF and DC specifications for the power amplifier interface signals. Refer to Table 4 for the DC voltage and
current specifications. Refer to Figures 4 through 15 for the RF performance.
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute
Maximum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these conditions or conditions greater than those defined in the
operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating con-
ditions may affect device reliability.)
Input power to pin 2 (P
IN
)..................................................... +5dBm
Average output power from pins 6 and 7 (P
OUT
)
1
for 8-contact XSON ................. +26dBm
1. Never measure with CW source. Pulsed single-tone source with <50% duty cycle is recommended. Exceeding the max-
imum rating of average output power could cause permanent damage to the device.
Average output power from pin 6 (P
OUT
)
1
for 6-contact XSON/X2SON................. +26dBm
Supply Voltage to pins1, 3, and 8 (V
CC
) for 8-contact XSON.....................-0.3V to +4.6V
Supply Voltage to pins 1, 3, and 6 (V
CC
) for 6-contact XSON/X2SON..............-0.3V to +4.6V
Reference voltage to pin 4 (V
REF
).........................................-0.3V to +3.3V
DC supply current (I
CC
)
2
..................................................... 400mA
2. Measured with 100% duty cycle 54 Mbps 802.11g OFDM Signal
Operating Temperature (T
A
)............................................. -40ºC to +85ºC
Storage Temperature (T
STG
) ........................................... -40ºC to +120ºC
Maximum Junction Temperature (T
J
)............................................ +150ºC
Surface Mount Solder Reflow Temperature ............................ 260°C for 10 seconds
Table 3: Operating Range
Range Ambient Temp V
DD
Industrial -40°C to +85°C 3.3V
T3.1 75041

SST12LP19E-QX6E

Mfr. #:
Manufacturer:
Microchip Technology
Description:
RF Amplifier WLAN 11b/g/n PA Low Current
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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