FERD2045SB-TR

Characteristics
FERD2045S
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0
10
20
30
40
50
60
70
80
0 5 10 15 20 25 30 35 40
S
Cu
(cm²)
R
th(j-a)
(°C/W)
DPAK
Epoxy printed board FR4, e
Cu
= 35 µm
90
100
Figure 7: Thermal resistance junction to ambient versus copper surface under tab for DPAK
FERD2045S
Package information
DocID031305 Rev 1
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2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
Cooling method: by conduction (C)
Epoxy meets UL 94,V0
2.1 DPAK package information
Figure 8: DPAK package outline
This package drawing may slightly differ from the physical package. However, all
the specified dimensions are guaranteed.
Package information
FERD2045S
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Table 5: DPAK package mechanical data
Ref.
Dimensions
Millimeters
Inches
Min.
Max.
Min.
Max.
A
2.18
2.40
0.085
0.094
A1
0.90
1.10
0.035
0.043
A2
0.03
0.23
0.001
0.009
b
0.64
0.90
0.025
0.035
b4
4.95
5.46
0.194
0.215
c
0.46
0.61
0.018
0.024
c2
0.46
0.60
0.018
0.023
D
5.97
6.22
0.235
0.244
D1
4.95
5.60
0.194
0.220
E
6.35
6.73
0.250
0.265
E1
4.32
5.50
0.170
0.216
e
2.286 typ.
0.090 typ.
e1
4.40
4.70
0.173
0.185
H
9.35
10.40
0.368
0.409
L
1.0
1.78
0.039
0.070
L2
1.27
0.050
L4
0.60
1.02
0.023
0.040
V2
-
+8°
-
+8°
Figure 9: DPAK recommended footprint (dimensions in mm)

FERD2045SB-TR

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Rectifiers 45 V field-effect rectifier diode
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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