MQ172 Series●Micro-Miniature Interface Connectors For Power Supply / Signaling
BRecommended Temperature Profile
(soldering requirements)
●Board
Dimensions: 50X33X0.8(mm)
Material: glass epoxy
●Cream soldering
Composition: Sn 96.5 / Ag 3.0 / Cu 0.5
Metal mask thickness: 0.15mm
●Reflow method
IR reflow
●Measurement spot of setting temperature
Housing (mold) surface
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
03/2009
Apr.1.2017 Copyright 2017 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
