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1734709-9

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24
General Description
The MAX9726 stereo, DirectDrive™, headphone amplifier
with BassMax and volume control is ideal for portable
audio applications where space is at a premium and per-
formance is essential. The MAX9726 operates from a sin-
gle 2.7V to 5.5V power supply and includes features that
reduce external component count, system cost, board
space, and offer improved audio reproduction. High
85dB PSRR makes the MAX9726 ideal for direct connec-
tion to a battery-powered supply and eliminates the need
for a dedicated LDO. The MAX9726 features Maxim’s
industry-leading click-and-pop suppression circuitry,
which reduces/eliminates audible transients during
power-up and power-down.
The headphone amplifier uses Maxim’s DirectDrive archi-
tecture that produces a ground-referenced output from a
single supply, eliminating the need for large DC-blocking
capacitors. The headphone amplifiers deliver 105mW into
a 32Ω load and feature low 0.02% THD+N.
The BassMax feature boosts the bass response of the
amplifier, improving audio reproduction when using inex-
pensive headphones. The integrated volume control fea-
tures 64 discrete volume levels, eliminating the need for
an external potentiometer. External resistors set the
MAX9726’s overall gain allowing for custom gain settings.
BassMax and the volume control are enabled through the
I
2
C/SMBus
™
-compatible interface. Shutdown can be con-
trolled through the hardware or software interface.
The MAX9726 consumes only 5.5mA of supply current,
provides short-circuit and thermal-overload protection,
and is specified over the -40°C to +85°C extended tem-
perature range. The MAX9726 is available in a tiny
(2mm x 2.5mm x 0.62mm) 20-bump chip-scale pack-
age (UCSP™) and a 20-pin TQFN package (4mm x
4mm x 0.75mm).
Applications
Features
♦ 105mW DirectDrive Headphone Amplifier
Eliminates Bulky DC-Blocking Capacitors
♦ 2.7V to 5.5V Single-Supply Operation
♦ Integrated 64-Level Volume Control
♦ High 85dB PSRR at 1kHz
♦ Software-Enabled Bass Boost (BassMax)
♦ Industry-Leading Click-and-Pop Suppression
♦ ±7.5kV HBM ESD-Protected Headphone Outputs
♦ Short-Circuit and Thermal-Overload Protection
♦ Low-Power Shutdown Mode (8μA)
♦ Low 0.02% THD+N
♦ I
2
C/SMBus-Compatible Interface
♦ Available in Space-Saving, Thermally Efficient
Packages
20-Bump UCSP (2mm x 2.5mm x 0.62mm)
20-Pin TQFN (4mm x 4mm x 0.75mm)
MAX9726
DirectDrive, Headphone Amplifier with
BassMax, I
2
C, Volume and Gain Control
________________________________________________________________
Maxim Integrated Products
1
Ordering Information
I
2
C
INTERFACE
VOLUME
CONTROL
BassMax
BassMax
2.7V TO 5.5V SUPPLY
SCL
BML
OUTL
BMR
OUTR
SDA
INL
INR
FBR
FBL
MAX9726
Σ
Σ
Simplified Block Diagram
19-0627; Rev 1; 3/08
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
Pin Configurations appear at end of data sheet.
Note: All devices specified over the -40°C to +85°C operating
range.
+
Denotes lead-free package.
*
EP = Exposed pad.
T = Tape and reel.
PART
PIN-PACKAGE
SLAVE ADDRESS
MAX9726AEBP+T 20 UCSP-20 1001100
MAX9726AETP+ 20 TQFN-EP* 1001100
MAX9726BEBP+T 20 UCSP-20 1001101
MAX9726BETP+ 20 TQFN-EP* 1001101
SMBus is a trademark of Intel Corp.
UCSP is a trademark of Maxim Integrated Products, Inc.
EVALUATION KIT
AVAILABLE
MAX9726
DirectDrive, Headphone Amplifier with
BassMax, I
2
C, Volume and Gain Control
2
______________________________________________________________________________________________________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS (5V Supply)
(V
DD
= SHDN = 5V, PGND = SGND = 0V, C1 = C2 = 1µF, C
PREG
= C
NREG
= 1µF, BM_ = 0V, R
IN
= 10kΩ, R
F
= 10kΩ, maximum vol-
ume (overall gain = 0dB), BassMax disabled. Load connected between OUT_ and PGND where specified. T
A
= T
MIN
to T
MAX
, unless
otherwise noted. Typical values are at T
A
= +25°C.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V
DD
to PGND............................................................-0.3V to +6V
PV
SS
to SV
SS
.........................................................-0.3V to +0.3V
SGND to PGND .....................................................-0.3V to +0.3V
C1P to PGND..............................................-0.3V to (V
DD
+ 0.3V)
C1N to PGND............................................(PV
SS
- 0.3V) to +0.3V
PV
SS
, SV
SS
to PGND ................................................+0.3V to -6V
IN_ to SGND...................................(SV
SS
- 0.3V) to (V
DD
+ 0.3V)
FB_ to SGND..................................(SV
SS
- 0.3V) to (V
DD
+ 0.3V)
SDA, SCL to PGND ....................................-0.3V to (V
DD
+ 0.3V)
SHDN to PGND ..........................................-0.3V to (V
DD
+ 0.3V)
OUT_ to SGND ............................................................-3V to +3V
BM_ to SGND ..............................................................-3V to +3V
Duration of OUT_ Short Circuit to PGND....................Continuous
Continuous Current Into/Out of:
V
DD
, C1P, PGND, C1N, PV
SS
, SV
SS
, or OUT_ ...........±850mA
Any Other Pin................................................................±20mA
Continuous Power Dissipation (T
A
= +70°C, multilayer board)
20-Bump UCSP (derate 10mW/°C above +70°C) .......800mW
20-Pin TQFN (derate 25.6mW/°C above +70°C) .......2051mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
OUTL and OUTR ESD Protection (Human Body Model)....±7.5kV
Bump Temperature (soldering) Reflow............................+230°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
GENERAL
Supply Voltage Range V
DD
2.7 5.5 V
Quiescent Supply Current I
DD
No load 5.5 10 mA
Shutdown Supply Current I
DD_SHDN
SHDN
= 0V 8 15 µA
Turn-On Time t
ON
440 µs
Turn-Off Time t
OFF
1µs
Thermal-Shutdown Threshold T
THRES
+150 °C
Thermal-Shutdown Hysteresis T
HYST
12 °C
HEADPHONE AMPLIFIER
Output Offset Voltage V
OSHP
Measured between OUT_ and SGND, gain
= 0dB, R
IN
= R
F
= 10kΩ, T
A
= +25°C
(Note 2)
±0.6 10 mV
Input Offset Voltage of Input
Amplifier
V
OS
Referenced to SGND, measured between
FBR, FBL, and SGND
3mV
Input Bias Current I
B
±20 ±100 nA
BMR, BML Input Bias Current I
BIAS_BB
±20 ±100 nA
DC, V
DD
= 2.7V to 5.5V 80 97
f = 1kHz, 100mV
P-P
ripple 85
Power-Supply Rejection Ratio
(Note 2)
PSRR
f = 20kHz, 100mV
P-P
ripple 74
dB
R
L
= 16Ω 124
Output Power P
OUT
THD+N = 1%,
f
IN
= 1kHz
R
L
= 32Ω 104
mW
R
L
= 16Ω, P
OUT
= 15mW, f
IN
= 1kHz 0.04
Total Harmonic Distortion Plus
Noise
THD+N
R
L
= 32Ω, P
OUT
= 30mW, f
IN
= 1kHz 0.02
%
MAX9726
DirectDrive, Headphone Amplifier with
BassMax, I
2
C, Volume and Gain Control
_______________________________________________________________________________________
3
ELECTRICAL CHARACTERISTICS (5V Supply) (continued)
(V
DD
= SHDN = 5V, PGND = SGND = 0V, C1 = C2 = 1µF, C
PREG
= C
NREG
= 1µF, BM_ = 0V, R
IN
= 10kΩ, R
F
= 10kΩ, maximum vol-
ume (overall gain = 0dB), BassMax disabled. Load connected between OUT_ and PGND where specified. T
A
= T
MIN
to T
MAX
, unless
otherwise noted. Typical values are at T
A
= +25°C.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
BW = 22Hz to 22kHz 102
Signal-to-Noise Ratio SNR
R
L
= 32Ω,
V
OUT
=
1.77V
RMS
A-weighted 105
dB
Slew Rate SR 1 V/µs
Capacitive Drive No sustained oscillations 200 pF
Output Resistance in Shutdown R
OUT_SHDN
V
SHDN
= 0V, measured from OUT_ to
SGND
50 kΩ
Into
shutdown
59
Click-and-Pop Level K
CP
Peak voltage, A-weighted,
32 samples per second
(Notes 2, 4)
Out of
shutdown
61
dBV
Charge-Pump Switching
Frequency
f
CP
515 610 705 kHz
Crosstalk
L to R, or R to L, f = 10kHz,
V
OUT
= 1V
P-P
, R
L
= 32Ω, both channels
loaded
85 dB
VOLUME CONTROL
0 to 64dB ±0.1
68dB to 96dB ±0.5
Attenuator Step Accuracy
100dB to 120dB ±2
dB
DIGITAL INPUTS (SHDN, SDA, SCL)
Input High Voltage V
IH
0.7 x
V
DD
V
Input Low Voltage V
IL
0.3 x
V
DD
V
Input Leakage Current ±1 µA
DIGITAL OUTPUTS (SDA)
Output Low Voltage V
OL
I
OL
= 3mA 0.06 V
Output High Current I
OH
V
SDA
= V
DD
1µA
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
R
L
= 16Ω 80
Output Power P
OUT
THD+N = 1%,
f
IN
= 1kHz
R
L
= 32Ω 70
mW
R
L
= 16Ω, P
OUT
= 15mW, f
IN
= 1kHz 0.05
Total Harmonic Distortion Plus
Noise
THD+N
R
L
= 32Ω, P
OUT
= 30mW, f
IN
= 1kHz 0.03
%
ELECTRICAL CHARACTERISTICS (3.3V Supply)
(V
DD
= SHDN = 3.3V, PGND = SGND = 0V, C1 = C2 = 1µF, C
PREG
= C
NREG
= 1µF, BM_ = 0V, R
IN
= 10kΩ, R
F
= 10kΩ, maximum
volume (overall gain = 0dB), BassMax disabled. Load connected between OUT_ and PGND where specified. T
A
= T
MIN
to T
MAX
,
unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 1)
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24

1734709-9

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Buy 1734709-9
Manufacturer:
TE Connectivity
Description:
Headers & Wire Housings 9 POS HDR R/A 1.0mm
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