MAX9726
Summing Amplifier (Audio Mixer)
Figure 10 shows the MAX9726 configured as a sum-
ming amplifier, which allows multiple audio sources to
be linearly mixed together. Using this configuration, the
output of the MAX9726 is equal to the weighted sum of
the input signals:
As shown in the above equation, the weighting or
amount of gain applied to each input signal source is
determined by the ratio of R
F
and the respective input
resistor (R
IN1
, R
IN2
, R
IN3
) connected to each signal
source. When BassMax is enabled, the low-frequency
gain (A
BOOST
) set by R1, R2, and C3 (see the
Gain-
Setting Components
section) adds to the gain deter-
mined by R
F
and R
IN_
. Select R
F
and R
IN_
such that the
dynamic range of the MAX9726 is not exceeded when
BassMax is enabled and/or when the input signals are
at their maximum values and in phase with each other.
Layout and Grounding
Proper layout and grounding are essential for optimum
performance. Connect PGND and SGND together at a
single point (star ground point) on the PC board.
Connect PV
SS
to SV
SS
at the device and bypass this
connection with a 1µF capacitor to PGND. Bypass V
DD
,
PREG, and NREG to PGND with a 1µF capacitor. Place
the power-supply bypass capacitor and the charge-
pump hold capacitor as close as possible to the
MAX9726. Route PGND, and all traces that carry
switching transients, away from SGND and the audio
signal path. Route digital signal traces away from the
audio signal path. Make traces perpendicular to each
other when routing digital signals over or under audio
signals.
The TQFN package features an exposed pad that
improves thermal efficiency. Ensure that the exposed
pad is electrically isolated from PGND, SGND, and
V
DD
. Connect the exposed pad to PV
SS
when the
board layout dictates that the exposed pad cannot
be left unconnected.
UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, PC board tech-
niques, bump-pad layout, and recommended reflow
temperature profile, as well as the latest information on
reliability testing results, go to Maxim’s website at
www.maxim-ic.com/ucsp and look up the Application
Note:
UCSP—A Wafer-Level Chip-Scale Package
.
DIAGRAM SHOWN WITH BassMax DISABLED.