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NFE31PT470C1E9L

P1-P3P4-P6P7-P8
Spec. No. JENF243E-0002Q-01 P4 / 8
MURATA MFG. CO., LTD.
Reference Only
10.2. Specification of Taping
(1) Packing quantity (standard quantity)
2000 pcs. / reel
(2) Packing Method
Products shall be packaged in the cavity of the plastic tape and sealed with cover tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
The cover tape have no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
10.3. Pull Strength of Plastic Tape and Cover Tape
Plastic tape 5N min.
Cover tape 10N min.
10.4. Peeling off force of cover tape
0.2N to 0.7N (minimum value is typical)
∗ Speed of Peeling off : 300 mm / min
10.5. Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows.
(in: mm)
10.6. Marking for reel
Customer part number , MURATA part number , Inspection number(∗1) , RoHS marking(∗2) , Quantity , etc
∗1) « Expression of Inspection No. » □□
OOOO ×××
(1) (2) (3)
(1)
Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D
Third, Fourth digit : Day
(3) Serial No.
∗2) « Expression of RoHS marking » ROHS – Y
(△)
(1) (2)
(1)
RoHS regulation conformity parts.
(2) MURATA classification number
10.7. Marking for Outside package (corrugated paper box)
Customer name , Purchasing Order Number , Customer Part Number , MURATA part number ,
RoHS marking (∗2) , Quantity , etc
165 to 180 degree
F
Cover tape
Plastic tape
Empty tape
190 min.
Leader
Trailer
Cover tape
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
180±
φ
60±
9±
13±1.4
1
0
0
3
Direction of feed
210 min.
160 min.
1
0
Label
Spec. No. JENF243E-0002Q-01 P5 / 8
MURATA MFG. CO., LTD.
Reference Only
10.8. Specification of Outer Case
Outer Case Dimensions
(mm)
Standard Reel Quantity in Outer Case
(Reel)
W D H
186 186 93 5
∗ Above Outer Case size is typical. It depends on a quantity of an order.
11. Standard Land Dimensions
The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground.
Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be
arranged according to figure to reinforce the ground-pattern.
(Standard land dimensions for reflow)
･Side on which chips are mounted
12. ! Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment
(5)Medical equipment (6)Transportation equipment(automobiles, trains, ships, etc.) (7)Traffic signal equipment
(8)Disaster prevention / crime prevention equipment (9)Data-processing equipment
(10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
13. Notice
Products can only be soldered with reflow.
If it were soldered with flow, cracks might be caused in the ceramic body.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
13.1. Flux and Solder
Flux Use rosin-based flux, Do not use highly acidic flux (with chlorine content
exceeding 0.2(wt)%).
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
13.2. Note for Assembling
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and products
surface is limited to 100 °C max. Also cooling into solvent after soldering should be in such a way that the
temperature difference is limited to 100°C max.
Resist
Copper foil pattern
No pattern
1.2
2.2
4.2
1.0
2.6
3.0
Small diamenter thru hole
(
φ
0.4)
0.6
(in mm)
W
D
Label
H
Spec. No. JENF243E-0002Q-01 P6 / 8
MURATA MFG. CO., LTD.
Reference Only
13.3. Attention Regarding P.C.B. Bending
The following shall be considered when designing P.C.B.'s and laying out products.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
〔Products direction〕
Products shall be located in the sideways
direction (Length:a
<b) to the mechanical stress.
(2) Products location on P.C.B. near seam for separation.
Products (A,B,C,D) shall be located carefully so that
products are not subject to the mechanical stress due
to warping the board.
Because they may be subjected the mechanical
stress in order of A
>C>B ≅ D.
13.4. Reflow Soldering
• Standard printing pattern of solder paste.
1) Solder paste printing for reflow
· Standard thickness of the solder paste should be 150µm to 200μm.
· Use the solder cream printing pattern of the right pattern.
· For the resist and copper foil pattern, use standard land dimensions.
2) Soldering Conditions
Standard soldering profile and the limit soldering profile is as follows.
The excessive soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of
product quality.
Standard Profile Limit Profile
Pre-heating 150°C ~ 180°C , 90s ± 30s
Heating above 220°C , 30s ~ 60s above 230°C , 60s max.
Peak temperature 245°C ± 3°C 260°C , 10s
Cycle of reflow 2 times 2 times
〈
Poor example
〉
〈
Good example
〉
b
a
Seam
Slit
A
D
B
C
b
a
Lengh:a<b
0.6
2.2
4.2
2.6
0.6
1.0
(in mm)
Limit Profile
Standard Profile
90s±30s
230°C
260°C
245°C±3°C
220°C
30s
～
60s
60s max.
180
150
Temp.
Time.(s)
(°C)
P1-P3P4-P6P7-P8

NFE31PT470C1E9L

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Description:
Feed Through Capacitors 47PF 25V 6.0A EMI FI
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