Spec. No. JENF243E-0002Q-01 P7 / 8
MURATA MFG. CO., LTD.
Reference Only
13.5. Reworking with Soldering iron
The following conditions shall be strictly followed when using a soldering iron.
• Pre-heating: 150°C, 1 min • Soldering iron output: 30W max.
• Tip temperature/ Soldering time: 350°C max. / 3(+1,-0) s (NFE31PT152Z1E9: 280 °C max. / 10 s max. )
• Tip diameter: φ3mm max. • Times: 2times max.
Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on
the ceramic material due to the thermal shock.
13.6. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60 °C max. (40° C max. for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the
mounted products and P.C.B.
Power: 20W / l max. Frequency: 28kHz to 40kHz Time: 5 minutes max.
(3) Cleaner
1. Cleaner
· Isopropyl alcohol (IPA)
2. Aqueous agent
· PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in
order to remove the cleaner.
(5) Other cleaning
Please contact us.
13.7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the performance,
such as insulation resistance may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
13.8. Resin coating
It may affect on the product's performance when using resin for coating / molding products. So please pay your
careful attention in selecting resin. In prior to use, please make the reliability evaluation with the product
mounted in your application set.
13.9. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
