340
Revised: July 9, 2008
©2008 Littelfuse, Inc.
Teccor
®
brand Thyristors
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
Standard Bidirectional DIAC Trigger
HTxxx & HTMxxx & STxxx Series
Figure 6: Circuit Used to Measure DIAC
Characteristics (Refer to Figure 4)
Figure 7: Peak Output Current vs. Triggering
Capacitance (Per Figure 5 with R
L
of 20 Ω)
120 V rms
60 Hz
47 k
D.U.T.
R
L
20
1%
V
C
100 k
*
C
T
I
L
0.1 μF
* Adjust for one firing in each half cycle. D.U.T. = Diac
Triggering Capacitance (C
T
) – μF
Peak Output Current (I
PK
) – mA
0
50
100
150
200
250
300
.01
.02
.03
.04
.05
.06
.07
.08 .09
.10
Typical (35
V Device)
Soldering Parameters
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (min to max) (t
s
) 60 – 190 secs
Average ramp up rate (Liquidus Temp
(T
L
) to peak
5°C/second max
T
S(max)
to T
L
- Ramp-up Rate 5°C/second max
Reflow
- Temperature (T
L
) (Liquidus) 217°C
- Time (min to max) (t
s
) 60 – 150 seconds
Peak Temperature (T
P
) 260 °C
Time within 5°C of actual peak
Temperature (t
p
)
20 – 40 seconds
Ramp-down Rate 5°C/second max
Time 25°C to peak Temperature (T
P
) 8 minutes Max.
Do not exceed 280°C
Time
Temperature
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
Preheat
P
reheat
Ramp-upRamp-up
Ramp-down
R
am
p
-
do
341
©2008 Littelfuse, Inc.
Revised: July 9, 2008
Teccor
®
brand Thyristors
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
341
©2008 Littelfuse, Inc.
Teccor
®
brand Thyristors
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
HTxxx & HTMxxx & STxxx Series
Standard Bidirectional DIAC Trigger
DIACs
Physical Specifications
Terminal Finish
100% Matte-Tin Plated/ Pb-Free Solder
Dipped
Body Material
DO-214: UL recognized epoxy meeting
flammabilty classification 94V-0.
DO-35/MINIMELF: Glass case body
Lead Material
DO-214: Copper Alloy
DO-35/MINIMELF: Copper Clad Iron
Reliability/Environmental Tests
Test
Specifications and Conditions
High Temperature
Voltage Blocking
MIL-STD-750, M-1040, Cond A Applied
80% of Rated Min V
BO
(VAC-peak) @
125°C for 1008 hours
Temperature Cycling
MIL-STD-750, M-1051,
100 cycles; -40°C to +150°C;
15-min dwell-time
Temperature/
Humidity
EIA / JEDEC, JESD22-A101
1008 hours; 80% of Rated Min V
BO
(V
DC
):
85°C; 85%
rel humidity
High Temp Storage MIL-STD-750, M-1031,1008 hours; 150°C
Low-Temp Storage 1008 hours; -40°C
Thermal Shock
MIL-STD-750, M-1056
10 cycles; 0°C to 100°C; 5-min dwell
time at each temperature; 10 sec (max)
transfer time between temperature
Autoclave
EIA / JEDEC, JESD22-A102 168 hours
(121°C at 2 ATMs) and 100% R/H
Resistance to
Solder Heat
MIL-STD-750 Method 2031
Solderability ANSI/J-STD-002, category 3, Test A
Lead Bend
MIL-STD-750, M-2036 Cond E
Burn-in 1 firing per 1/2 cycle, 168 hours
Dimensions – MINIMELF / SOD-80 (MM Package)
A
C
C
D
B
.002 E-F
E
F
Dimensions
Inches Millimeters
Min Typ Max Min Typ Max
A 0.125 0.134 0.142 3.18 3.40 3.61
B 0.066 0.068 0.070 1.68 1.73 1.78
C 0.012 0.018 0.020 0.30 0.46 0.51
D 0.063 1.60
Design Considerations
Dimensions – DO-35 (Y Package)
C
B
B
A
E
TYP.
D (TYP.)
Dimension
Inches Millimeters
Min Max Min Max
A (Note 1) 0.060 0.090 1.530 2.280
B
(Note 2) 0.015 0.381
C
(Note 1) 0.135 0.165 3.430 4.190
D 0.018 0.022 0.458 0.558
E 1.000 25.400
Notes:
1. Package contour optional within dimensions A and C. Slugs, if any, shall be included
within this cylinger but shall not be subject to
the minimum limit of Dimention A.
2. Lead diameter is not controlled in this zone to allow for flash, lead finish build-up and
minor irregularities other than slugs.
Careful selection of the correct device for the applications
operating parameters and environment will go a long
way toward extending the operating life of the Thyristor.
Overheating and surge currents are the main killers of
DIACs. Correct mounting, soldering, and forming of the
leads also help protect against component damage.
342
Revised: July 9, 2008
©2008 Littelfuse, Inc.
Teccor
®
brand Thyristors
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
Standard Bidirectional DIAC Trigger
HTxxx & HTMxxx & STxxx Series
Dimensions – DO-214 (S Package)
H
KJE
AC
D
B
T / T TEMPERATURE
MEASUREMENT POINT
CL
G
L
F
Recommended Soldering Pad Outline
(Reference Only)
2.80
(.110”)
2.00
(.079”)
2.00
(.079”)
Dimension
Inches Millimeters
Min Max Min Max
A 0.140 0.155 3.56 3.94
B 0.205 0.220 5.21 5.59
C 0.077 0.083 1.96 2.11
D 0.166 0.180 4.22 4.57
E 0.036 0.063 0.91 1.60
F 0.066 0.083 1.67 2.11
G 0.004 0.008 0.10 0.20
H 0.077 0.086 1.96 2.18
J 0.043 0.053 1.09 1.35
K 0.008 0.012 0.20 0.30
L 0.039 0.049 0.99 1.24
Packing Options
Part
Number
Marking Package
Weight/
Unit
Packing
Mode
Base
Quantity
Quantity
Reel Box
HTM-xxxRP MINIMELF 0.040g Tape & Reel 5000 2500
HT-xxxRP DO35 0.150g Tape & Reel 5000 5000
HT-xxx DO35 0.150g Bulk 5000 5000
ST-xxxRP STxxx DO214 0.075g Tape & Reel 2500 2500

ST40RP

Mfr. #:
Manufacturer:
Littelfuse
Description:
Diacs ST40RP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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