TLP109(IGM)
2014-09-01
1
TOSHIBA Photocoupler GaAℓAs Ired & Photo−IC
TLP109(IGM)
Intelligent Power Module (IPM)
Digital Logic Isolation
Industrial Inverters
The Toshiba TLP109(IGM) mini-flat coupler is a small-outline coupler
suitable for surface-mount assembly.
The TLP109(IGM) consists of a high-output-power GaAℓAs light emitting
diode optically coupled to a high-speed photodiode-transistor chip.
The TLP109(IGM) is housed in the SO6 package and guarantees a
creepage distance of ≥ 5.0 mm, a clearance of ≥ 5.0 mm and an insulation
thickness of ≥ 0.4 mm. Therefore, the TLP109(IGM) meets the reinforced
insulation class requirements of international safety standards.
The TLP109(IGM) guarantees minimum and maximum of propagation
delay time, switching time dispersion, and high common mode transient
immunity. Therefore TLP109(IGM) is suitable for isolation interface
between IPM(Intelligent Power Module) and control IC circuits in motor
control application.
• Isolation voltage: 3750 Vrms (min)
• Common mode transient immunity: ±10 kV/μs (min)
@V
CM
=1500 V Pin Configuration (Top View)
• Switching time: t
pHL,
t
pLH
=0.1 μs (min)
=0.8 μs (max)
@I
F
=10 mA, V
CC
=15 V,
R
L
=20 kΩ, Ta=25°C
• Switching time dispersion: 0.7 μs (max)
(|t
pLH
−t
pHL
|)
• TTL compatible
• UL approved :UL1577, File No.E67349
• c-UL approved :CSA Component Acceptance Service
No. 5A, File No.E67349
Schematic
• Option (V4)
VDE approved : DIN EN60747-5-2
Maximum Operating Insulation Voltage :
707 V
PK
Highest Permissible Over Voltage
: 6000 V
PK
(Note) : When a EN60747-5-2 approved type is needed,
Please designate “Option(V4)”
• Construction Mechanical Ratings
Creepage distance: 5.0 mm (min)
Clearance distance: 5.0 mm (min)
Insulation thickness: 0.4 mm (min)
TOSHIBA 11−4L1
Weight: 0.08 g (typ.)
Unit: mm
1: ANODE
3: CATHODE
4: EMITTER (GND)
5: COLLECTOR (OUTPUT)
6: V
CC
V
CC
GND
V
O
I
CC
I
O
6
5
4
3
I
F
V
F
SHIELD
1
0.1
2.1 ± 0.1
4.55
1
3
3.7
7.0 ± 0.4
0.4
2.54
0.5 min
0.15
+0.25
-0.15
+0.25
-0.15
Start of commercial production
2010/10