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TLP109(V4-TPL,E

P1-P3P4-P6P7-P9P10-P11
TLP109(IGM)
2014-09-01
4
Switching Characteristics
(Ta = 25°C, V
CC
= 15 V)
Characteristic Symbol
Test
Circuit
Test Condition Min Typ. Max Unit
Propagation delay time (H→ L)
Propagation delay time (L→ H)
t
pHL
t
pLH
1
I
F
=10 mA, R
L
=20 kΩ 0.1 0.45 0.8
μs
I
F
=10 mA, R
L
=20 kΩ
Ta=0 to 85°C
0.1 0.45 0.9
I
F
=10 mA, R
L
=20 kΩ
Ta=−25~100°C
0.1 0.45 1.0
Switching time
dispersion between on
and off
|t
pLH
−t
pHL
|
I
F
=10 mA, R
L
=20 kΩ ― 0.15 0.7
μs
I
F
=10 mA, R
L
=20 kΩ
Ta=0 to 85°C
― 0.25 0.8
I
F
=10 mA, R
L
=20 kΩ
Ta=−25 to 100°C
― 0.25 0.9
Common mode
transient immunity at
logic high output
(Note 6)
CM
H
2
I
F
=0 mA, V
CM
=1500 V
p−p
R
L
=20 kΩ
10000 15000 ― V / μs
Common mode
transient immunity at
logic low output
(Note 6)
CM
L
I
F
=10 mA, V
CM
=1500 V
p−p
R
L
=20 kΩ
−10000
−15000
― V / μs
(Note 6) CM
L
is the maximum rate of fall of the common mode voltage that can be
sustained with the output voltage in the logic low state (V
O
< 1 V).
CM
H
is the maximum rate of rise of the common mode voltage that can be
sustained with the output voltage in the logic high state (V
O
> 4 V).
(Note 7) Maximum electrostatic discharge voltage for any pins: 100 V (C = 200 pF, R=0).
TLP109(IGM)
2014-09-01
5
Test Circuit 1: Switching Time Test Circuit
Test Circuit 2: Common Mode Transient Immunity Test Circuit
)(
)(
=,
)(
)(
=
μs
f
t
V1200
L
CM
μs
r
t
V1200
H
CM
V
O
V
CM
1500V
0V
90%
15V
4V
1V
V
OL
t
r
t
f
10%
V
O
(I
F
= 10mA)
(I
F
= 0mA)
I
F
Pulse gen
Z
O
= 50Ω
V
CM
Output
monitor
V
O
0.1μF
V
CC
= 5V
1
3
4
5
6
R
L
PW = 100μs
Duty ratio = 1/10
I
F
monitor
Pulse input
Output
monitor
V
O
0.1μF
100Ω
V
CC
= 15V
1
3
4
5
6
R
L
V
O
I
F
15V
1.5V
0
V
OL
t
pLH
t
pHL
1.5V
I
F
TLP109(IGM)
2014-09-01
6
PRECAUTIONS OF SURFACE MOUNTING TYPE PHOTOCOUPLER SOLDERING &
GENERAL STORAGE
(1) Precautions for Soldering
1) When Using Soldering Reflow
An example of a temperature profile when Sn-Pb eutectic solder is used:
An example of a temperature profile when lead(Pb)-free solder is used:
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
2) When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Apply preheating of 150 °C for 60 to 120 seconds.
Mounting condition of 260 °C or less within 10 seconds is recommended.
Flow soldering must be performed once.
3) When using soldering iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Complete soldering within 10 seconds for lead temperature not exceeding 260 °C or within 3 seconds
not exceeding 350 °C.
Heating by soldering iron must be only once per lead.
P1-P3P4-P6P7-P9P10-P11

TLP109(V4-TPL,E

Mfr. #:
Buy TLP109(V4-TPL,E
Manufacturer:
Toshiba
Description:
High Speed Optocouplers Photo-IC -0.5 to 30V 125degC 3750 Vrms
Lifecycle:
New from this manufacturer.
Delivery:
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