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74AUP1G34GX4Z

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21
Nexperia
74AUP1G34
Low-power buffer
74AUP1G34 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved.
Product data sheet Rev. 7 — 28 March 2017
16 / 21
References
Outline
version
European
projection
Issue date
IEC JEDEC EIAJ
SOT1226
sot1226_po
12-04-10
12-04-25
Unit
mm
max
nom
min
0.35 0.85
0.80
0.75
0.04 0.30
0.25
0.20
0.85
0.80
0.75
0.27
0.22
0.17
0.05
A
(1)
Dimensions
Note
1. Dimension A is including plating thickness.
2. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
SOT1226
A
1
A
3
0.128
0.040
D D
h
E b e
0.48
k L v
0.1
w y
0.05 0.05
scale
0
1
m
m
X
terminal 1
index area
D
E
A B
detail X
A
A
1
A
3
C
y
C
y
1
5 4
terminal 1
index area
D
h
L
b
k
e
AC
B
v
Cw
21
0.20
0.27
0.22
0.17
y
1
X2SON5: plastic thermal enhanced extremely thin small outline package; no leads;
5 terminals; body 0.8 x 0.8 x 0.35 mm
3
Figure 17. Package outline SOT1226 (X2SON5)
Nexperia
74AUP1G34
Low-power buffer
74AUP1G34 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved.
Product data sheet Rev. 7 — 28 March 2017
17 / 21
References
Outline
version
European
projection
Issue date
IEC JEDEC JEITA
SOT1454-1 - - -
sot1454-1_po
15-11-16
14-12-16
Unit
mm
max
nom
min
0.100 0.68 0.47
0.15 0.05
A
Dimensions (mm are the original dimensions)
WLCSP6: wafer level chip-scale package, 6 bumps; 0.65 x 0.44 x 0.27 mm SOT1454-1
A
1
A
2
0.22
0.18
0.085 0.65 0.44 0.22
b D E e e
1
0.23
e
2
0.44
v w
0.05
y
0.1
y
1
0.070 0.62 0.41
0.30
0.27
0.24
0.20
0.085
0.055
0.070
X
detail X
0
scale
1 mm
A
E
B
D
e
2
e
e
1
b
AC BØ v
CØ w
21
B
C
y
A
A
2
A
1
C
A
ball A1
index area
ball A1
index area
C
y
1
Figure 18. Package outline SOT1454-1 (WLCSP6)
Nexperia
74AUP1G34
Low-power buffer
74AUP1G34 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved.
Product data sheet Rev. 7 — 28 March 2017
18 / 21
13 Abbreviations
Table 11. Abbreviations
Acronym Description
CDM Charged Device Model
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
MM Machine Model
14 Revision history
Table 12. Revision history
Document ID Release date Data sheet status Change notice Supersedes
74AUP1G34 v.7 20170328 Product data sheet - 74AUP1G34 v.6
Modifications: • Added type number 74AUP1G34UK (SOT1454-1/WLCSP6)
74AUP1G34 v.6 20120628 Product data sheet - 74AUP1G34 v.5
Modifications: • Added type number 74AUP1G34GX (SOT1226)
• Package outline drawing of SOT886 (Figure 13) modified.
74AUP1G34 v.5 20111128 Product data sheet - 74AUP1G34 v.4
Modifications: • Legal pages updated.
74AUP1G34 v.4 20100714 Product data sheet - 74AUP1G34 v.3
74AUP1G34 v.3 20080814 Product data sheet - 74AUP1G34 v.2
74AUP1G34 v.2 20060704 Product data sheet - 74AUP1G34 v.1
74AUP1G34 v.1 20050804 Product data sheet - -
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21

74AUP1G34GX4Z

Mfr. #:
Buy 74AUP1G34GX4Z
Manufacturer:
Nexperia
Description:
Low-Power Buffer 1-CH Non-Inverting CMOS 4-Pin X2SON T/R - Tape and Reel (Alt: 74AUP1G34GX4Z)
Lifecycle:
New from this manufacturer.
Delivery:
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