Spec No. JELF243B-0006Q-01 P.7/9
MURATA MFG.CO., LTD
Reference
Only
(2) Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150°C～180°C, 90s±30s
Heating above 220°C, 30s～60s above 230°C, 60s max.
Peak temperature 245°C±3°C 260°C, 10s
Cycle of reflow 2 times 2 times
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating 150°C, 1 min
Tip temperature 350°C max.
Soldering iron output 80W max.
Tip diameter φ3mm max.
Soldering time 3(+1, -0)s
Time 2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the
crack on the products due to the thermal shock.
11.5 Solder Volume
･ Solder shall be used not to be exceeded the upper limits as shown below.
･ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
1/3T≦t≦T
T： thickness of product
11.6 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the
board.
［Products direction］
Products shall be located in the sideways
direction (Length: a
< b) to the mechanical
stress.
(2) Products location on P.C.B. separation
Products (A, B, C, D) shall be located carefully
so that products are not subject to the
mechanical stress due to warping the board.
Because they may be subjected the
mechanical tress in order of A
>C >B ≅ D.
Upper Limit
Recommendable
t
〈
Poor example
〉
〈
Good example
〉
b
a
Seam
Slit
A
D
B
C
b
a
Length:a
<
b
Limit Profile
Standard Profile
90s±30s
230℃
260℃
245℃±3℃
220℃
30s～60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
