10
FN7045.3
May 4, 2007
FIGURE 35. OFFSET VOLTAGE vs TEMPERATURE FIGURE 36. INPUT BIAS CURRENT vs TEMPERATURE
FIGURE 37. CMRR vs TEMPERATURE FIGURE 38. PSRR vs TEMPERATURE
FIGURE 39. SLEW RATE vs TEMPERATURE FIGURE 40. POSITIVE OUTPUT SWING vs TEMPERATURE
Typical Performance Curves (Continued)
0
-1
-2
-3
-50 0 100 15050
DIE TEMPERATURE (°C)
V
S
= ±5V
V
S
= ±15V
V
OS
(mV)
-50 0 100 15050
DIE TEMPERATURE (°C)
I
B
+ (µA)
-10
-15
-20
-25
-30
120
100
80
60
-50 0 100 15050
DIE TEMPERATURE (°C)
CMRR (dB)
V
S
= ±5V
V
S
= ±15V
110
100
90
80
-50 0 100 15050
DIE TEMPERATURE (°C)
PSRR (dB)
V
S
= ±5V
V
S
= ±15V
240
220
200
180
160
-50 0 100 15050
DIE TEMPERATURE (°C)
SR (V/µs)
V
S
= ±5V
V
S
= ±15V
V
O
= 2V
PP
3.9
3.7
3.6
3.5
3.8
-50
DIE TEMPERATURE (°C)
V
OUTH
(V)
0 100 15050
V
S
= ±5V
EL2125
11
FN7045.3
May 4, 2007
FIGURE 41. POSITIVE OUTPUT SWING vs TEMPERATURE FIGURE 42. NEGATIVE OUTPUT SWING vs TEMPERATURE
FIGURE 43. NEGATIVE OUTPUT SWING vs TEMPERATURE FIGURE 44. LOADED NEGATIVE OUTPUT SWING vs
TEMPERATURE
FIGURE 45. NEGATIVE OUTPUT SWING vs TEMPERATURE FIGURE 46. LOADED POSITIVE OUTPUT SWING vs
TEMPEARTURE
Typical Performance Curves (Continued)
13.6
13.5
13.4
-50
DIE TEMPERATURE (°C)
0 100 15050
V
OUTH
(V)
V
S
= ±15V
-9.75
-9.8
-9.85
-9.9
-9.95
-50
DIE TEMPERATURE (°C)
V
OUTL
(V)
0 10050
V
S
= ±5V
150
-13.4
-13.5
-13.6
-13.7
-50
DIE TEMPERATURE (°C)
V
OUTL
(V)
0 100 15050
V
S
= ±15V
-3.42
-3.44
-3.46
-3.48
-3.5
-3.52
-50
DIE TEMPERATURE (°C)
V
OUTL2
(V)
0 100 15050
V
S
= ±5V
-9.6
-9.8
-10
-10.2
-10.4
-10.6
-10.8
-50
DIE TEMPERATURE (°C)
V
OUTL2
(V)
010015050
V
S
= ±15V
3.35
3.3
3.25
-50
DIE TEMPERATURE (°C)
V
OUTH2
(V)
010015050
V
S
= ±5V
EL2125
12
FN7045.3
May 4, 2007
FIGURE 47. LOADED POSITIVE OUTPUT SWING vs
TEMPERATURE
FIGURE 48. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
FIGURE 49. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
Typical Performance Curves (Continued)
12
11.8
11.6
11.4
11.2
11
-50
DIE TEMPERATURE (°C)
V
OUTH2
(V)
0 100 15050
V
S
= ±15V
1.2
0.6
0
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
0
AMBIENT TEMPERATURE (°C)
POWER DISSIPATION (W)
25 125 15075
1
0.4
0.8
0.2
10050 85
488mW
781mW
SO8
θ
JA
=160°C/W
SOT23-5
θ
JA
=256°C/W
1.8
0.8
0
1.6
0.4
1.2
0.2
0.6
1.4
1
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
0
AMBIENT TEMPERATURE (°C)
POWER DISSIPATION (W)
25 125 15075 10050 85
543mW
1.136W
SO8
θ
JA
=110°C/W
SOT23-5
θ
JA
=230°C/W
EL2125

EL2125CSZ-T7

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
High Speed Operational Amplifiers EL2125CSZ LW NOISE CVR A=11
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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