BD3539FVM-TR

BD3539FVM,BD3539NUX
Technical Note
10/11
www.rohm.com
2009.10 - Rev.
A
© 2009 ROHM Co., Ltd. All rights reserved.
Heat loss
Thermal design must be conducted with the operation under the conditions listed below (which are the guaranteed
temperature range requiring consideration on appropriate margins etc);
1: Ambient temperature Ta: 100 or lower
2:Chip junction temperature Tj: 150 or lower
The chip junction temperature Tj can be considered as follows:
Because package with FIN is used at IC bottom side, package power changes considerably by copper foil area, which is
connected. Please radiate heat by taking enough area for board surface or using many through hole to inner layer pattern.
Most of heat loss in BD3539FVM/NUX occurs at the output N-channel FET. The power lost is determined by multiplying the
voltage between VIN and Vo by the output current. As this IC employs the power PKG, the thermal derating characteristics
significantly depends on the pc board conditions. When designing, care must be taken to the size of a pc board to be used.
Power consumption (W) = Input voltage (V
TT_IN
)-Output voltage(V
TT
VDDQ)×Io(Ave)
Example) Where V
TT_IN
=1.5V, VDDQ=1.5V, Io(Ave)= 0.5A
Heat dissipation characteristics [Tc]
MSOP8
Heat dissipation characteristics [Ta]
MSOP8 VSON008X2030
Calculation based on IC surface
temperature Tc, mounted on a board
Tj=Tc+θj-c×W
Calculation based on ambient temperature Ta
Tj=Ta+θj-a×W
With no heat sink
1-layer board(copper foil area:70×70mm
2
)
4-layer board(copper foil area:70×70mm
2
)
PCB size: 70×70×1.6mm
3
(
with thermal via
)
θj-a:VSON008X2030 516.5/W
242.7/W
142.5/W
Reference example
θj-a:MSOP-8 212.8/W
322.6/W
With no heat sink
1-layer board(copper foil area :70×70mm
2
)
2.72W
[W]
0 25 75 100 125 50
1.0
0.5
0
3.0
2.5
150
[]
1-layer board
θja=46.0/W
2.0
1.5
Ambient Temperature [Ta]
PCB size:70×70×1.6mm
(Board copper foil area: :70×70mm
2
)
<Reference example>
θj-c:MSOP-8 46.0/W
Power Dissipation [Pd]
[W]
0 25 75 100 125 150 50
[]
Ambient Temperature [Ta]
0.5
0.25
0
1.0
0.75
(1) 877.2mW
(2) 515.0mW
(3) 242.0mW
(1) 4-layer boardcopper foil area : 5505mm
2
Every layer has copper foil area,θja=142.5/W
(2) 1-layer board
θja=242.7/W
(3) With no heat sink
θja=516.5/W
(1) 587.4mW
[mW]
0 25 75 100 125 50
200
100
0
600
500
150
[]
(1) 1-layer board
θja=212.8/W
(2) with no heat sink
θja=322.6/W
Power Dissipation [Pd]
400
300
Ambient Temperature [Ta]
(2) 387.4mW
= 0.375(W)
Power consumption(W) = 1.5(V)-0.75(V) ×0.5(A)
1
2
BD3539FVM,BD3539NUX
Technical Note
11/11
www.rohm.com
2009.10 - Rev.
A
© 2009 ROHM Co., Ltd. All rights reserved.
Ordering part number
B D 3 5 3 9 F V M - T R
Part No. Part No.
3539
Package
FVM: MSOP8
NUX: VSON008X2030
Packaging and forming specification
TR: Embossed tape and reel
Direction of feed
Reel
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
TR
()
1pin
(Unit : mm)
MSOP8
0.08 S
S
4.0±0.2
8
3
2.8±0.1
1
6
2.9±0.1
0.475
4
57
(MAX 3.25 include BURR)
2
1PIN MARK
0.9MAX
0.75±0.05
0.65
0.08±0.05
0.22
+0.05
0.04
0.6±0.2
0.29±0.15
0.145
+0.05
0.03
4°
+
6°
4°
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
4000pcs
TR
()
Direction of feed
Reel
1pin
(Unit : mm)
VSON008X2030
5
1
8
4
1.4±0.1
0.25
1.5±0.1
0.5
0.3±0.1
0.25
+0.05
0.04
C0.25
0.6MAX
(0.12)
0.02
+0.03
0.02
3.0±0.1
2.0±0.1
1PIN MARK
0.08 S
S
R0039
A
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© 2009 ROHM Co., Ltd. All rights reserved.
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Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
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BD3539FVM-TR

Mfr. #:
Manufacturer:
Description:
Power Management Specialized - PMIC MEMORY IC REG
Lifecycle:
New from this manufacturer.
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