AQ1
–5–
ASCTB24E 201509-T
4. Heat sink (for AQ10A2-ZT4/32VDC)
NOTE
External dimensions
General tolerance: ±0.5 ±.020
27±2
58±2
13.8
5.2
8888888
47.6
40
9
2-M3 Screw
2-M3 Screw depth: min. 10mm
Knurl surface
30±2
2.5
1.063±.079
2.283±.079
.543
.205
1.874
1.575
.354
1.181±.079
.098
.315.315.315.315.315.315.315
Heat sink attached to AQ1 relay
Note: When using heat sink, please refer to “Thermal Design”
CAD Data
5. DC output, 1A and 2A types (Vertical)
External dimensions
General tolerance: ±0.5 ±.020
12.7
(25.4)
7.62 5.08
6
4-0.8 dia.
25
1
10
5.3
33
INPUT
OUTPUT
1
2
3
4
.500
.236
4-.031 dia.
.984
.039
.394
.209
1.299
(1.000)
.300 .200
Mounting hole location
(Copper-side view)
Schematic
Tolerance: ±0.1 ±.004
4-1.2 dia.
2.54× 3
2.54× 5
2.54× 2
25.4
4321
Copper foil
4-.047 dia.
.100× 5
.100× 2
1.000
.100× 3
LOAD INPUT
SSR
2134
Load
power source
+– +–
Load
Input
power source
CAD Data
1. When using bent output terminals
To avoid applying mechanical stress on
the main unit and molded section of the
solid state relay, radio pliers should be
used to grasp the terminals between the
point of bending and the molded case
when making the bends.
2. Thermal design
When a heat sink is mounted on the
10 A type
The heat sink (AQ-HS-5A) or a radiator
which can make good contact should be
used.
If a heat sink is used in which the contact
condition is bad, a heat conducting
compound should be used to improve the
heat radiation. (Ex. Momentive
Performance Materials Inc. YG6111 or
TSK5303) The compound should be
applied between the heat sink and the
AQ1.
Solid state relay
Terminal bend section
Printed circuit board
Solder
AQ-HS-5A heat sink
(provided with AQ-HS-5A)
Printed circuit board
Approx. 0.6N·m of torque should be
used for tightening the M3 screws.
AQ10A2-ZT4/32VDC
4-M3 screws
