M27C2001 List of figures
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List of figures
Figure 1. Logic Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. DIP Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 3. LCC Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 4. TSOP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 5. Programming Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 6. AC Testing Input Output Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 7. AC Testing Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 8. Read Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 9. Programming and Verify Modes AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 10. FDIP32W - 32 pin Ceramic Frit-seal DIP, with window, Package Outline . . . . . . . . . . . . . 19
Figure 11. PDIP32 - 32 lead Plastic DIP, 600 mils width, Package Outline. . . . . . . . . . . . . . . . . . . . . 20
Figure 12. PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Outline . . . . . . . . . . . . . . . . . . . 21
Figure 13. TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package Outline . . . . . . . . . . . 22
Obsolete Product(s) - Obsolete Product(s)
Summary description M27C2001
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1 Summary description
The M27C2001 is a high speed 2 Mbit EPROM offered in the two ranges UV (ultra violet
erase) and OTP (one time programmable). It is ideally suited for microprocessor systems
requiring large programs and is organized as 262,144 by 8 bits.
The FDIP32W (window ceramic frit-seal package) has a transparent lids which allow the
user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be
written to the device by following the programming procedure.
For applications where the content is programmed only one time and erasure is not
required, the M27C2001 is offered in PDIP32, PLCC32 and TSOP32 (8 x 20 mm) packages.
In order to meet environmental requirements, ST offers the M27C2001 in ECOPACK
®
packages.
ECOPACK packages are Lead-free. The category of second Level Interconnect is marked
on the package and on the inner box label, in compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 1. Logic Diagram
Table 1. Signal Names
A0-A17 Address Inputs
Q0-Q7 Data Outputs
E
Chip Enable
G
Output Enable
P
Program
V
PP
Program Supply
V
CC
Supply Voltage
V
SS
Ground
AI00716B
18
A0-A17
P
Q0-Q7
V
PP
V
CC
M27C2001
G
E
V
SS
8
Obsolete Product(s) - Obsolete Product(s)
M27C2001 Summary description
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Figure 2. DIP Connections
Figure 3. LCC Connections
A1
A0
Q0
A7
A4
A3
A2
A6
A5
A13
A10
A8
A9
Q7
A14
A11
G
E
Q5Q1
Q2
Q3V
SS
Q4
Q6
A17
PA16
A12
V
PP
V
CC
A15
AI00717
M27C2001
8
1
2
3
4
5
6
7
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
AI00718
A17
A8
A10
Q5
17
A1
A0
Q0
Q1
Q2
Q3
Q4
A7
A4
A3
A2
A6
A5
9
P
A9
1
A16
A11
A13
A12
Q7
32
V
PP
V
CC
M27C2001
A15
A14
Q6
G
E
25
V
SS
Obsolete Product(s) - Obsolete Product(s)

M27C2001-10C1

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
EPROM 2M (256Kx8) 100ns
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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