96D3-2G1600NN-TRL

TS5KNN30100-6S
240Pin DDR3 1600 VLP UDIMM
2GB Based on 256Mx8
Transcend Information Inc.
7
Timing Parameters & Specifications
Speed DDR3 1600 Unit
Parameter Symbol Min Max
Average Clock Period
tCK 1.25 <1.5 ns
CK high-level width
tCH 0.47 0.53 tCK
CK low-level width tCL 0.47 0.53 tCK
DQS, /DQS to DQ skew, per group, per access
tDQSQ - 100 ps
DQ output hold time from DQS, /DQS
tQH 0.38 - tCK
DQ low-impedance time from CK, /CK
tLZ(DQ) -450 225
ps
DQ high-impedance time from CK, /CK
tHZ(DQ) - 225
ps
Data setup time to DQS, /DQS reference to
Vih(ac)Vil(ac) levels
tDS 10 - ps
Data hold time to DQS, /DQS reference to
Vih(ac)Vil(ac) levels
tDH 45
ps
DQ and DM input pulse width for each input
tDIPW 360 - ps
DQS, /DQS Read preamble
tRPRE 0.9 - tCK
DQS, /DQS differential Read postamble
tRPST 0.3 - tCK
DQS, /DQS Write preamble
tWPRE 0.9 - tCK
DQS, /DQS Write postamble
tWPST 0.3 - tCK
DQS, /DQS low-impedance time
tLZ(DQS)
-450 225 ps
DQS, /DQS high-impedance time
tHZ(DQS)
- 225 ps
DQS, /DQS differential input low pulse width
tDQSL 0.45 0.55 tCK
DQS, /DQS differential input high pulse width
tDQSH 0.45 0.55 tCK
DQS, /DQS rising edge to CK, /CK rising edge
tDQSS -0.27 +0.27 tCK
DQS, /DQS falling edge setup time to CK, /CK
rising edge
tDSS
0.18 -
tCK
DQS, /DQS falling edge hold time to CK, /CK
rising edge
tDSH 0.18 - tCK
Delay from start of Internal write transaction to
Internal read command
tWTR
Max
(4tck, 7.5ns)
-
Write recovery time tWR
15 -
ns
Mode register set command cycle time
tMRD 4 - tCK
/CAS to /CAS command delay
tCCD
4 - nCK
Auto precharge write recovery + precharge time
tDAL
tWR+tRP
/tck
nCK
Active to active command period for 1KB page
size
tRRD
Max
(4tck, 6ns)
-
Active to active command period for 2KB page
size
tRRD
Max
(4tck, 7.5ns)
-
Four Activate Window for 1KB page size
products
tFAW 30 - ns
TS5KNN30100-6S
240Pin DDR3 1600 VLP UDIMM
2GB Based on 256Mx8
Transcend Information Inc.
8
Speed DDR3 1600 Unit
Parameter Symbol Min Max
Four Activate Window for 2KB page size
products
tFAW 40 - ns
Power-up and RESET calibration time
tZQinitl
512 - tCK
Normal operation Full calibration time tZQoper
256
-
tCK
Normal operation short calibration time tZQcs 64
-
tCK
Exit self refresh to commands not requiring a
locked DLL
tXS
Max
(5tCK,
tRFC+10ns)
-
Exit self refresh to commands requiring a locked
DLL
tXSDLL
tDLL(min) - tCK
Internal read to precharge command delay tRTP
Max
(4tck, 7.5ns)
-
Minimum CKE low width for Self refresh entry to
exit timing
tCKESR tCK(min)+1tCK
-
-
Exit power down with DLL to any valid
command: Exit Precharge Power Down with
DLL
tXP
Max
(3tCK, 6ns)
-
CKE minimum pulse width (high and low pulse
width)
tCKE
Max
(3tCK, 5ns)
Asynchronous RTT turn-on delay (Power-Down
mode)
tAONPD 2 8.5
ns
Asynchronous RTT turn-off delay (Power-Down
mode)
tAOFPD
2 8.5 ns
ODT turn-on tAON -225 225
ps
ODT turn-off tAOF 0.3 0.7
tCK
TS5KNN30100-6S
240Pin DDR3 1600 VLP UDIMM
2GB Based on 256Mx8
Transcend Information Inc.
9
SERIAL PRESENCE DETECT SPECIFICATION
TS5KNN30100-6S Serial Presence Detect
Byte No.
Function Described Standard Specification
Vendor Part
0
Number of SPD Bytes written / SPD device size / CRC
coverage during module production
CRC:0-116Byte
SPD Byte use: 176Byte
SPD Byte
total: 256
Byte
92
1
SPD Revision
Version 1.0
10
2
Key Byte / DRAM Device Type
DDR
3
SDRAM
0B
3
Key Byte / Module Type
UDIMM
0
2
4
SDRAM Density and Banks
2Gb 8banks
0
3
5
SDRAM Addressing
ROW:15, Column:10
1
9
6
Reserved
-
00
7
Module Organization
1Ran
k / x8
01
8
Module Memory Bus Width
Non ECC, 64bit
03
9
Fine Timebase Dividend and Divisor
2.5p
s
52
10
Medium Timebase Dividend
0.125ns
01
11
Medium Timebase Divisor
0.125ns
08
12
SDRAM Minimum Cycle Time (tCKmin)
1.25n
s
0A
13
Reserved
-
00
14
CAS
Latencies Supported, Least Significant Byte
6, 7, 8, 9, 10, 11
F
C
15
CAS Latencies Supported, Most Significant Byte
-
00
16
Minimum CAS Latency Time (tAAmin)
13.125ns
6
9
17
Minimum Write Recovery Time (tWRmin)
15ns
78
18
Minimum /RAS to /CAS Delay Time
(tRCDmin)
13.125ns
6
9
19
Minimum Row Active to Row Active Delay Time
(tRRDmin)
6ns 30
20
Minimum Row Precharge Time (tRPmin)
13.125ns
6
9
21 Upper Nibble for tRAS and tRC
-
11
22
Minmum Active to Precharge Time (tRASmin)
35ns
18
23 Minmum Active to Active/Refresh Time (tRCmin) 48.125ns 81
24
Minmum Refresh Recovery Time (tRFCmin), Least
Significant Byte
160ns 00
25
Minmum Refresh Recovery Time (tRFCmin), Most
Significant Byte
160ns 05
26
Minmum Internal Write to Read Command Delay Time
(tWTmin)
7.5ns 3C
27
Minimum Internal Read to Precharge Command Delay
Time (tRTPmin)
7.5ns 3C
28 Upper Nibble for tFAW 30ns 00
29 Minmum Four Active Window Delay Time (tFAWmin) 30ns F0
30 SDRAM Optional Features
DLL off Mode,
RZQ/6, RZQ/7
83
31 SDRAM Thermal and Refresh Options No ODTs, No ASR 01
32-59
Reserved
- 00
60
Module Nominal Height
18.75mm 04

96D3-2G1600NN-TRL

Mfr. #:
Manufacturer:
Advantech
Description:
Memory Modules 2G DDR3-1600 240PIN 256X8 VLP SAM(G)
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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