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74ALVC162334ADGG:1

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20
74ALVC162334A_3 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 03 — 13 December 2006 15 of 19
NXP Semiconductors
74ALVC162334A
16-bit registered driver (3-state)
14.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 13) than a PbSn process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 12 and 13
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 13.
Table 12. SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm
3
)
< 350 ≥ 350
< 2.5 235 220
≥ 2.5 220 220
Table 13. Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm
3
)
< 350 350 to 2000 > 2000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245
74ALVC162334A_3 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 03 — 13 December 2006 16 of 19
NXP Semiconductors
74ALVC162334A
16-bit registered driver (3-state)
For further information on temperature profiles, refer to Application Note
AN10365
“Surface mount reflow soldering description”
.
15. Abbreviations
16. Revision history
MSL: Moisture Sensitivity Level
Fig 13. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Table 14. Abbreviations
Acronym Description
CMOS Complementary Metal Oxide Semiconductor
TTL Transistor-Transistor Logic
Table 15. Revision history
Document ID Release date Data sheet status Change notice Supersedes
74ALVC162334A_3 20061213 Product data sheet - 74ALVC162334A_2
Modifications:
• The format of this data sheet has been redesigned to comply with the new identity guidelines of
NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Section 1 “General description”, 1
st
paragraph, 2
nd
sentence: changed “OE” to “OE”
• Table 2 “Ordering information”: changed (SOT364-1; TSSOP56) package to (SOT362-1;
TSSOP48) package
• Table 3 “Pin description” corrected:
– changed “Y
1
to Y
18
” to (Y1 to Y16, noted separately)
– GND pins: added pins 4 and 39
– V
CC
pins changed from “7, 22, 35, 50” to “7, 18, 31, 42”
– changed “A
1
to A
18
” to (A1 to A16, noted separately)
• Figure 1 “Logic symbol (IEEE/IEC)”: corrected pin number for Y15 from “21” to “22”
74ALVC162334A_3 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 03 — 13 December 2006 17 of 19
NXP Semiconductors
74ALVC162334A
16-bit registered driver (3-state)
Modifications:
(continued)
• Figure 1 “Logic symbol (IEEE/IEC)”: corrected pin number for Y15 from “21” to “22”
• Figure 2 “Logic diagram”:
– changed signal “A
0
” to “A1”
– changed signal “Y
0
” to “Y1”
– changed “to the 17 other channels” to “to the 15 other channels”
• Table 5 “Limiting values” (title changed from “Absolute maximum ratings”):
– parameter definition of I
IK
changed from “DC input diode current” to “input clamping current”
– parameter definition of I
OK
changed from “DC output diode current” to “output clamping
current”
– symbol “I
O
” (DC output source or sink current) changed to “I
O(sink/source)
” (output sink or
source current)
– removed P
tot
/pack information for SSOP package
• Table 7 “Static characteristics” (title changed from “DC electrical characteristics”):
– changed symbol “I
I
” to “I
LI
”
– parameter definition of I
OZ
changed from “3-State output OFF-state current” to “OFF-state
output current” (moved “3-state” to Conditions column)
– parameter definition of I
CC
changed from “quiescent supply current” to “supply current”
– parameter definition of ∆I
CC
changed from “additional quiescent supply current” to
“additional supply current”
– added C
i
, C
io
, and C
PD
parameters
• Section 11 “Dynamic characteristics”: table “AC characteristics for V
CC
= 3.0 V to 3.6 V range
and V
CC
= 2.7 V” separated into 2 tables
• Section 11.1 “AC waveforms”:
– 1
st
paragraph, 2
nd
line: changed “V
M
= 1.5 V
CC
” to “V
M
= 1.5 V”
– removed statement “V
M
= 0.5V
CC
at V
CC
= 2.3 V to 2.7 V.” from Figure 5, Figure 6, Figure 7,
Figure 8, Figure 9 and Figure 10 as redundant (depends on voltage as stated above these
figures)
• Section 13 “Package outline”: replaced SOT364-1 (TSSOP56) package outline drawing with
Figure 12 “Package outline SOT362-1 (TSSOP48)”
74ALVC162334A_2
(9397 750 07246)
20000620 Product specification 853-2197 23931 74ALVC162334A_1
74ALVC162334A_1
(9397 750 06963)
20000314 Product specification 853-2197 23314 -
Table 15. Revision history
…continued
Document ID Release date Data sheet status Change notice Supersedes
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74ALVC162334ADGG:1

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Latches 16-bit registered drive
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