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NLV74HC03ADR2G

P1-P3P4-P6P7-P8
MC74HC03A
http://onsemi.com
4
Figure 1. Switching Waveforms
C
L
*
*Includes all probe and jig capacitance
TEST
POINT
DEVICE
UNDER
TEST
OUTPUT
Figure 2. Test Circuit
1kW
R
pd
V
CC
INPUT A
90%
50%
10%
t
f
t
r
GND
V
CC
OUTPUT Y
t
PZL
t
THL
HIGH
IMPEDANCE
V
OL
10%
t
PLZ
90%
50%
10%
V
O
, OUTPUT VOLTAGE (VOLTS)
012345
0
5
10
15
20
25
I
D
, SINK CURRENT (mA)
Figure 3. Open−Drain Output Characteristics
A1
B1
A2
B2
An
Bn
1/4
HC03
1/4
HC03
1/4
HC03
Y1
Y2
Yn
TYPICAL
T=25°C
T=25°C
T=85°C
T=125°C
EXPECTED MINIMUM*
V
CC
=5V
*The expected minimum curves are not guarantees, but are design aids.
V
CC
PULLUP
RESISTOR
OUTPUT
OUTPUT = Y1 • Y2 • . . . • Yn
= A1B1
• A2B2 • . . . • AnBn
Figure 4. Wired AND
LED1
1/4
HC03
LED2
LED
ENABLE
V
CC
+
V
R
-
+
V
F
-
1/4
HC03
V
CC
DESIGN EXAMPLE
CONDITIONS: I
D
^10mA
TYPICAL CURVE, at I
D
=10mA,
V
DS
^0.4V
NR +
V
CC
* V
F
* V
O
I
D
+
5V * 1.7V * 0.4V
10mA
USE R = 270W
+ 290W
Figure 5. LED Driver With Blanking
MC74HC03A
http://onsemi.com
5
ORDERING INFORMATION
Device Package Shipping
†
MC74HC03ADG SOIC−14
(Pb−Free)
55 Units / Rail
MC74HC03ADR2G SOIC−14
(Pb−Free)
2500 / Tape & Reel
MC74HC03ADTR2G TSSOP−14
(Pb−Free)
2500 / Tape & Reel
NLV74HC03ADG* SOIC−14
(Pb−Free)
55 Units / Rail
NLV74HC03ADR2G* SOIC−14
(Pb−Free)
2500 / Tape & Reel
NLV74HC03ADTR2G* TSSOP−14
(Pb−Free)
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable
MC74HC03A
http://onsemi.com
6
PACKAGE DIMENSIONS
SOIC−14 NB
CASE 751A−03
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
H
14
8
71
M
0.25 B
M
C
h
X 45
SEATING
PLANE
A1
A
M
_
S
A
M
0.25 B
S
C
b
13X
B
A
E
D
e
DETAIL A
L
A3
DETAIL A
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
D 8.55 8.75 0.337 0.344
E 3.80 4.00 0.150 0.157
A 1.35 1.75 0.054 0.068
b 0.35 0.49 0.014 0.019
L 0.40 1.25 0.016 0.049
e 1.27 BSC 0.050 BSC
A3 0.19 0.25 0.008 0.010
A1 0.10 0.25 0.004 0.010
M 0 7 0 7
H 5.80 6.20 0.228 0.244
h 0.25 0.50 0.010 0.019
__ __
6.50
14X
0.58
14X
1.18
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
P1-P3P4-P6P7-P8

NLV74HC03ADR2G

Mfr. #:
Buy NLV74HC03ADR2G
Manufacturer:
ON Semiconductor
Description:
Logic Gates QUAD 2-INPUT NAND GA
Lifecycle:
New from this manufacturer.
Delivery:
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