DAC8426
–9–
REV. C
APPLICATIONS SETUP
UNIPOLAR OUTPUT OPERATION
The output voltage appearing at any output V
OUT
is equal to the
internal 10 V reference multiplied by the decimal value of the
latched digital input divided by 2
8
(= 256). In equation form:
V
OUT
(D) = D/256 × 10 V
where D = 0
10
to 255
10
Figure 4. Amplifier Output Stage
Note that the maximum possible output is 1 LSB less than the
internal 10 V reference, that is, 255/256 × 10 V = 9.961 V.
Table II lists output voltages for a given digital input. The total
unadjusted error (TUE) specification of the product grade used
determines the output tolerances of the values listed in Table II.
For example, a ±2 LSB grade DAC8426FP loaded with decimal
128
10
(half-scale) would have a guaranteed output voltage oc-
curring in the range of 5 V ±2 LSB, which is 5 V ±(2 × 10 V/256)
= 5 V ±0.078 V. Therefore V
OUT
is guaranteed to occur in the
following range:
4.922 V V
OUT
(128) 5.078 V
Figure 5. DAC Output Current Sink
For the top grade DAC8426EP ±1 LSB total unadjusted error
(TUE), the guaranteed range is 4.961 V V
OUT
(128
10
) 5.039 V.
These tolerances provide the worst case analysis including tem-
perature changes.
One additional characteristic guaranteed is a DNL of ±1 LSB
on all grades. The DAC8426 is therefore guaranteed to be mon-
otonic. In the situation where a continuously positive 1 LSB
digital increment is applied, the output voltage will always in-
crease in value, never decrease. This is very important is servo
applications and other closed-loop feedback systems. Finally, in
the typical characteristic curves, long term output voltage drift
(stability) is provided.
BIPOLAR OUTPUT OPERATION
An external op amp plus two resistors can easily convert any
DAC output to bipolar output voltage swings. Figure 6 shows all
four DACs output operating in bipolar mode. This is the general
expression describing the bipolar output transfer equation:
V
OUT
(D) = [(1 +R
2
/R
1
) × D/256 × 10 V] –R
2
/R
1
× 10 V,
where D = 0
10
to 255
10
If R
1
= R
2
, then V
OUT
becomes:
V
OUT
(D) = (D/128–1) × 10 V
Table III lists various output voltages with R
1
= R
2
versus digital
input code. This coding is considered offset binary. Note that
the LSB step size is now 20 V/256 = 0.078 V, twice as large as
the unipolar output case previously discussed. In order to minimize
gain and offset errors, choose R
1
and R
2
to match and track
within 0.1% over the selected operating temperature range
of interest.
Table II. Unipolar Output Voltage as a Function of
Digital Input Code
Digital Input Analog Output
Code Voltage (= D/256 × 10 V)
255 9.961 V Full-Scale (FS)
254 9.922 V FS-1 LSB
129 5.039 V
128 5.000 V Half-Scale
127 4.961 V
1 0.039 V 1 LSB
0 0.000 V Zero-Scale
OFFSETTING AGND
Since the DAC ladder and bandgap reference are terminated at
AGND, it is possible to offset AGND positive with respect to
DGND. The 10 V output span remains if a positive offset is ap-
plied to AGND. The offset voltage source connected to AGND
must be capable of sinking 14 mA. AGND cannot be taken
negative with respect to DGND; this would forward bias an in-
ternal diode. Allowance must be made at V
DD
to maintain 3.5 V
of headroom above V
REF
OUT. This connection setup is useful
in single supply applications where virtual ground needs to be
slightly positive with respect to ground. In this application con-
nect V
SS
to DGND to take advantage of the extra buffer output
current sinking capability when the DAC output is programmed
to all zeros code, see Figure 7.
DAC8426
–10–
REV. C
Figure 6. Bipolar Operation
CONNECTION AND LAYOUT GUIDELINES
Layout and design techniques used in the interface between dig-
ital and analog circuitry require special attention to detail. The
following considerations should be evaluated prior to PCB layout.
1. Return signal paths through the ground system should be
carefully considered. High-speed digital logic current pulses
traveling on return ground traces generate glitches that can be
radiated to the analog circuits if the ground path layout pro-
duces loop antennas. Ground planes can minimize this situa-
tion. Separate digital and analog grounding areas to minimize
crosstalk. Ideally a single common-point ground should be on
the same PCB board as the DAC8426. The analog ground re-
turns should take advantage of the appropriate placement of
power supply bypass capacitors.
2. For optimum performance, bypass V
DD
and V
SS
(if using
negative supply voltage) with 0.1 µF ceramic disk capacitors
to shunt high-frequency spikes. Also use in parallel 6.8 µF to
10 µF capacitors to provide a charge reservoir for lower fre-
quency load change requirements. The reference output
(V
REF
OUT) should be bypassed with a 10 µF tantalum ca-
pacitor to optimize reference output stability during data in-
put changes. This helps to minimize digital crosstalk.
Table III. Bipolar Output Voltage as a Function of Digital
Input Code
Digital Input Analog Output
Code Voltage (= D/256 × 10 V)
255 9.922 V Full-Scale (FS)
254 9.844 V FS-1 LSB
129 0.078 V
128 0.000 V Zero-Scale
127 –0.078 V
1 –9.922 V
0 –10.000 V Neg Full-Scale
Figure 7. AGND Biasing Scheme Providing Offset Output
Range
3. Power Supply Sequencing—No special requirements exist
with the DAC8426. However, users should be aware that of-
ten the 5 V logic supply may be powered up momentarily
prior to the +15 V analog supply. In this situation, the
DAC8426 ESD input protection diodes will forward bias if
the applied input logic is at logic “1”. No damage will result
to the input since the DAC8426 is designed to withstand mo-
mentary currents of up to 130 mA. This situation will likely
exist for any DAC or ADC operating from a separate analog
supply.
4. ESD input protection—Attention has been given in the de-
sign of the DAC8426 to ESD sensitivity. Using the human
body model test technique (MIL-STD 3015.4) the DAC8426
generally will withstand 1500 V ESD transients on all pins.
Handling and testing prior to PCB insertion generally exposes
ICs to the toughest environment they will experience. Once
the IC is soldered in the PCB, it is still important to consider
any traces that connect to PCB edge connectors. These traces
should be protected with appropriate devices especially if the
boards will experience field replacement or adjustment. Han-
dling the exposed edge connectors by field maintenance
people in a low humidity environment can produce 20 kV
ESD transients which will be detrimental to almost any inte-
grated IC connected to the edge connector.
DAC8426
–11–
REV. C
MICROPROCESSOR INTERFACING
The DAC8426 easily interfaces to most 8- and 16-bit wide data-
bus systems. Serial and 4-bit busses can also be accommodated
with additional latches and control circuitry. Interfacing can be
accomplished with databus transfers running with 50 ns write
pulse widths.
Examples of various microprocessor interface circuits are pro-
vided in Figures 8 through 12. These figures have omitted cir-
cuitry not essential to the bus interface. The design process
should include review of the DAC8426 timing diagram with the
µP system timing diagram.
Figure 8. DAC8426 to 8085A Interface (Simplified circuit,
only lines of interest are shown.)
Figure 9. DAC8426 to Z-80 Interface (Simplified circuit,
only lines of interest are shown.)
Figure 10. DAC8426 to 6809 Interface (Simplified circuit,
only lines of interest are shown.)
Figure 11. DAC8426 to 6502 Interface (Simplified circuit,
only lines of interest are shown.)
Figure 12. DAC8426 to 68000 Interface (Simplified circuit,
only lines of interest are shown.)

DAC8426FP

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Digital to Analog Converters - DAC Quad 8B VOut CMOS w/ Internal 10V Ref
Lifecycle:
New from this manufacturer.
Delivery:
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