www.austriamicrosystems.com Revision 1.5 11 - 13
AS1101/AS1102/AS1103/AS1104
Data Sheet - Package Drawings and Markings
Figure 21. MSOP-8 Package
Symbol Millimeters ± Tolerance Symbol Millimeters ± Tolerance
A 1.10 Max b 0.33 +0.07 to -0.08
A1 0.10 ±0.05 b1 0.30 ±0.05
A2 0.86 ±0.08 c 0.18 ±0.05
D 3.00 ±0.10 c1 0.15 +0.03 to -0.02
D2 2.95 ±0.10
θ1 3.0º ±3.0º
E4.90 ±0.15
θ2 12.0º ±3.0º
E1 3.00 ±0.10
θ3 12.0º ±3.0º
E2 2.95 ±0.10 L 0.55 ±0.15
E3 0.51 ±0.13 L1 0.95 BSC
E4 0.51 ±0.13 aaa 0.10
R 0.15 +0.15 to -0.08 bbb 0.08
R1 0.15 +0.15 to -0.08 ccc 0.25
t1 0.31 ±0.08 e .65 BSC
t2 0.41 ±0.08 S .525 BSC
Notes:
1. All dimensions are in millimeters (angle in degrees), unless otherwise specified.
2. Datums B and C to be determined at datum plane H.
3. Dimensions D and E1 are to be determined at datum plane H.
4. Dimensions D2 and E2 are for top package and D and E1 are for bottom package.
5. Cross section A-A to be determined at 0.13 to 0.25mm from the lead tip.
6. Dimensions D and D2 do not include mold flash, protrusion, or gate burrs.
7. Dimension E1 and E2 do not include interlead flash or protrusion.
