Electrical characteristics
STF15N60M2-EP, STFI15N60M2-EP
4/15
DocID027373 Rev 1
2 Electrical characteristics
T
C
= 25 °C unless otherwise specified
Table 5: On/off states
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
V
(BR)DSS
Drain-source breakdown
voltage
V
GS
= 0 V, I
D
= 1 mA
600
V
I
DSS
Zero gate voltage drain
current
V
GS
= 0 V, V
DS
= 600 V
1
µA
V
GS
= 0 V, V
DS
= 600 V
T
C
= 125 °C
100
µA
I
GSS
Gate-body leakage current
V
DS
= 0 V, V
GS
= ±25 V
±10
µA
V
GS(th)
Gate threshold voltage
V
DS
= V
GS
, I
D
= 250 µA
2
3
4
V
R
DS(on)
Static drain-source on-
resistance
V
GS
= 10 V, I
D
= 5.5 A
0.340
0.378
Ω
Table 6: Dynamic
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
C
iss
Input capacitance
V
DS
= 100 V,f = 1 MHz,
V
GS
= 0 V
-
590
-
pF
C
oss
Output capacitance
-
30
-
pF
C
rss
Reverse transfer
capacitance
-
1.1
-
pF
C
oss eq.
(1)
Equivalent output
capacitance
V
DS
= 0 to 480 V,
V
GS
= 0 V
-
148
-
pF
R
G
Intrinsic gate resistance
f = 1 MHz, I
D
= 0 A
-
7
-
Ω
Q
g
Total gate charge
V
DD
= 480 V, I
D
= 11 A,
V
GS
= 10 V (see Figure
15: "Gate charge test
circuit")
-
17
-
nC
Q
gs
Gate-source charge
-
3.1
-
nC
Q
gd
Gate-drain charge
-
7.3
-
nC
Notes:
(1)
C
oss eq.
is defined as a constant equivalent capacitance giving the same charging time as C
oss
when V
DS
increases from 0 to 80% V
DSS.
Table 7: Switching energy
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
E
(off)
Turn-off energy
(from 90% V
GS
to 0% I
D
)
V
DD
= 400 V, I
D
= 1.5 A
R
G
= 4.7 Ω, V
GS
= 10 V
-
4.7
-
µJ
V
DD
= 400 V, I
D
= 3.5 A
R
G
= 4.7 Ω, V
GS
= 10 V
-
5.2
-
µJ
STF15N60M2-EP, STFI15N60M2-EP
Electrical characteristics
DocID027373 Rev 1
5/15
Table 8: Switching times
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
t
d(on)
Turn-on delay time
V
DD
= 300 V, I
D
= 5.5 A
R
G
= 4.7 Ω, V
GS
= 10 V (see
Figure 14: "Switching times
test circuit for resistive load"
and Figure 19: "Switching
time waveform" )
-
11
-
ns
t
r
Rise time
-
10
-
ns
t
d(off)
Turn-off-delay time
-
40
-
ns
t
f
Fall time
-
15
-
ns
Table 9: Source drain diode
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
I
SD
(1)
Source-drain current
-
11
A
I
SDM
(2)
Source-drain current (pulsed)
-
44
A
V
SD
(3)
Forward on voltage
V
GS
= 0 V, I = 11 A
-
1.6
V
t
rr
Reverse recovery time
I
SD
= 11 A, di/dt = 100 A/µs,
V
DD
= 60 V (see Figure 16: "
Test circuit for inductive load
switching and diode
recovery times" )
-
280
ns
Q
rr
Reverse recovery charge
-
2.7
µC
I
RRM
Reverse recovery current
-
19.5
A
t
rr
Reverse recovery time
I
SD
= 11 A, di/dt = 100 A/µs,
V
DD
= 60 V, T
j
= 150 °C
(see Figure 16: " Test circuit
for inductive load switching
and diode recovery times")
-
400
ns
Q
rr
Reverse recovery charge
-
3.8
µC
I
RRM
Reverse recovery current
-
19
A
Notes:
(1)
Limited by maximum junction temperature.
(2)
Pulse width is limited by safe operating area.
(3)
Pulsed: pulse duration = 300 µs, duty cycle 1.5%.
Electrical characteristics
STF15N60M2-EP, STFI15N60M2-EP
6/15
DocID027373 Rev 1
2.1 Electrical characteristics (curves)
Figure 2: Safe operating area
Figure 3: Thermal impedance
Figure 4: Output characteristics
Figure 5: Transfer characteristics
Figure 6: Normalized gate threshold voltage
vs temperature
Figure 7: Normalized V
(BR)DSS
vs temperature
GIPG200120151046MT
ID
1
0.1
0.1
1
VDS(V)
10
(A)
Operation in this area is
Limited by max R
DS(on)
10µs
1ms
100µs
0.01
Tj=150°C
Tc=25°C
Single pulse
10ms
100
10
K
10
-4
Tp(s)
10
-3
10
-2
10
-1
10
0
10
-3
10
-2
10
-1
GC20940
GIPG121220141416MT
ID
15
5
0
0
4
VDS(V)
8
(A)
12
6V
VGS=7, 8, 9, 10V
10
20
16
4V
5V
GIPG121220141419MT
ID
20
10
0
0
4
VGS(V)
8
(A)
2
6
5
15
VDS=17V
0.9
0.8
0.7
0.6
-75 -25 T
J
(°C)
1.0
25 75 125
I
D
= 250 µA
1.1
V
GS(th)
(norm)
GIPG181120141615ALS
GIPG191120141457ALS
-75
T
J
(°C)
-25 7525 125
0.88
0.92
0.96
1.04
1.00
1.08
I
D
= 1mA
V
(BR)DSS
(norm)

STF15N60M2-EP

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
MOSFET N-channel 600 V, 0.340 Ohm typ., 11 A MDmesh M2 EP Power MOSFET in a TO-220FP package
Lifecycle:
New from this manufacturer.
Delivery:
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