IRF7779L2TR1PBF

DirectFET Power MOSFET
Typical values (unless otherwise specified)
DirectFET ISOMETRIC
L8
Applicable DirectFET Outline and Substrate Outline
l RoHS Compliant, Halogen Free
l Lead-Free (Qualified up to 260°C Reflow)
l Ideal for High Performance Isolated Converter
Primary Switch Socket
l Optimized for Synchronous Rectification
l Low Conduction Losses
l High Cdv/dt Immunity
l Low Profile (<0.7mm)
l Dual Sided Cooling Compatible
l Compatible with existing Surface Mount Techniques
l Industrial Qualified
Description
The IRF7779L2TR/TR1PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET
TM
packaging to
achieve the lowest on-state resistance in a package that has a footprint smaller than a D
2
PAK and only 0.7 mm profile. The DirectFET package is
compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering
techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual
sided cooling to maximize thermal transfer in power systems.
The IRF7779L2TR/TR1PbF is optimized for high frequency switching and synchronous rectification applications. The reduced total losses in
the device coupled with the high level of thermal performance enables high efficiency and low temperatures, which are key for system reliability
improvements, and makes this device ideal for high performance power converters.
Fig 1. Typical On-Resistance vs. Gate Voltage
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Click on this section to link to the DirectFET Website.
Surface mounted on 1 in. square Cu board, steady state.
T
C
measured with thermocouple mounted to top (Drain) of part.
Repetitive rating; pulse width limited by max. junction temperature.
Starting T
J
= 25°C, L = 0.33mH, R
G
= 25Ω, I
AS
= 40A.
Notes:
Fig 2. Typical On-Resistance vs. Drain Current
SB SC M2 M4 L4 L6 L8
D
S
G
D
S
S
S
S S
S
S
4.0 6.0 8.0 10.0 12.0 14.0 16.0
V
GS
, Gate-to-Source Voltage (V)
0.00
10.00
20.00
30.00
40.00
50.00
T
y
p
i
c
a
l
R
D
S
(
o
n
)
,
(
m
Ω
)
T
J
= 25°C
T
J
= 125°C
I
D
= 40A
50 70 90 110
I
D
, Drain Current (A)
8.00
12.00
16.00
20.00
T
y
p
i
c
a
l
R
D
S
(
o
n
)
(
m
Ω
)
T
C
= 25°C
V
GS
= 7.0V
V
GS
= 8.0V
V
GS
= 10V
V
GS
= 15V
V
DSS
V
GS
R
DS(on)
150V min ±20V max
9.0mΩ@ 10V
Q
g tot
Q
gd
V
gs(th)
97nC 33nC 4.0V
IRF7779L2PbF
1 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback May 6, 2014
Form Quantity
IRF7779L2TRPbF DirectFET2 Large Can Tape and Reel 4000 "TR" suffix
IRF7779L2TR1PbF
DirectFET2 Large Can Tape and Reel 1000 "TR1" suffix EOL notice # 264
NoteOrderable part number Package Type
Standard Pack
Absolute Maximum Ratings
Parameter Units
V
DS
Drain-to-Source Voltage V
V
GS
Gate-to-Source Voltage
I
D
@ T
C
= 25°C
GS
@ 10V (Silicon Limited)
I
D
@ T
C
= 100°C
GS
@ 10V (Silicon Limited)
A
I
D
@ T
A
= 25°C
GS
@ 10V (Silicon Limited)
I
D
@ T
C
= 25°C
GS
@ 10V (Package Limited)
I
DM
Pulsed Drain Current
E
AS
Single Pulse Avalanche Energy mJ
I
AR
Avalanche Current A
375
270
Max.
47
11
270
±20
150
67
40
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IRF7779L2PbF
Notes:
Repetitive rating; pulse width limited by max. junction temperature.
Pulse width 400μs; duty cycle 2%.
Static @ T
J
= 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units
BV
DSS
Drain-to-Source Breakdown Voltage 150 ––– ––– V
ΔΒV
DSS
/ΔT
J
Breakdown Voltage Temp. Coefficient ––– 0.13 ––– V/°C
R
DS(on)
Static Drain-to-Source On-Resistance ––– 9.0 11
m
Ω
V
GS(th)
Gate Threshold Voltage 3.0 4.0 5.0 V
Δ
V
GS(th)
/
Δ
T
J
Gate Threshold Voltage Coefficient ––– -15 ––– mV/°C
I
DSS
Drain-to-Source Leakage Current ––– ––– 20 μA
––– ––– 250
I
GSS
Gate-to-Source Forward Leakage ––– ––– 100 nA
Gate-to-Source Reverse Leakage ––– ––– -100
gfs Forward Transconductance 83 ––– ––– S
Q
g
Total Gate Charge ––– 97 150
Q
gs1
Pre-Vth Gate-to-Source Charge ––– 27 –––
Q
gs2
Post-Vth Gate-to-Source Charge ––– 6.9 ––– nC
Q
gd
Gate-to-Drain Charge ––– 33 50
Q
godr
Gate Charge Overdrive ––– 30 ––– See Fig. 9
Q
sw
Switch Charge (Q
gs2
+ Q
gd
)
––– 40 –––
Q
oss
Output Charge ––– 39 ––– nC
R
G
Gate Resistance
–––
1.5 ––– Ω
t
d(on)
Turn-On Delay Time ––– 16 –––
t
r
Rise Time ––– 19 –––
t
d(off)
Turn-Off Delay Time ––– 36 ––– ns
t
f
Fall Time ––– 12 –––
C
iss
Input Capacitance ––– 6660 –––
C
oss
Output Capacitance ––– 840 ––– pF
C
rss
Reverse Transfer Capacitance ––– 180 –––
C
oss
Output Capacitance ––– 5620 –––
C
oss
Output Capacitance ––– 400 –––
Diode Characteristics
Parameter Min. Typ. Max. Units
I
S
Continuous Source Current ––– ––– 67
(Body Diode) A
I
SM
Pulsed Source Current ––– ––– 270
(Body Diode)
V
SD
Diode Forward Voltage ––– ––– 1.3 V
t
rr
Reverse Recovery Time ––– 110 170 ns
Q
rr
Reverse Recovery Charge ––– 510 770 nC
I
D
= 40A
V
DS
= 120V, V
GS
= 0V, T
J
= 125°C
V
GS
= 20V
V
GS
= -20V
V
GS
= 10V
V
DS
= 50V, I
D
= 40A
V
DS
= 75V
T
J
= 25°C, I
F
= 40A, V
DD
= 75V
di/dt = 100A/μs
T
J
= 25°C, I
S
= 40A, V
GS
= 0V
showing the
integral reverse
p-n junction diode.
V
DS
= V
GS
, I
D
= 250μA
V
DS
= 150V, V
GS
= 0V
Conditions
V
GS
= 0V, I
D
= 250μA
Reference to 25°C, I
D
= 2mA
V
GS
= 10V, I
D
= 40A
V
DS
= 16V, V
GS
= 0V
V
DD
= 75V, V
GS
= 10V
V
GS
= 0V
ƒ = 1.0MHz
I
D
= 40A
MOSFET symbol
R
G
=1.8Ω
V
DS
= 25V
Conditions
V
GS
= 0V, V
DS
= 120V, f=1.0MHz
V
GS
= 0V, V
DS
= 1.0V, f=1.0MHz
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IRF7779L2PbF
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Case
Surface mounted on 1 in. square Cu board, steady state.
T
C
measured with thermocouple incontact with top (Drain) of part.
Used double sided cooling, mounting pad with large heatsink.
Notes:
Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
R
θ
is measured at T
J
of approximately 90°C.
Surface mounted on 1 in. square Cu
board (still air).
Mounted on minimum footprint full size board with metalized
back and with small clip heatsink. (still air)
1E-006 1E-005 0.0001 0.001 0.01 0.1 1
t
1
, Rectangular Pulse Duration (sec)
0.0001
0.001
0.01
0.1
1
10
T
h
e
r
m
a
l
R
e
s
p
o
n
s
e
(
Z
t
h
J
C
)
°
C
/
W
0.20
0.10
D = 0.50
0.02
0.01
0.05
SINGLE PULSE
( THERMAL RESPONSE )
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
τ
J
τ
J
τ
1
τ
1
τ
2
τ
2
τ
3
τ
3
R
1
R
1
R
2
R
2
R
3
R
3
Ci i/Ri
Ci= τi/Ri
τ
τ
C
τ
4
τ
4
R
4
R
4
Ri (°C/W) τi (sec)
0.1080 0.000171
0.6140 0.053914
0.4520 0.006099
1.47e-05 0.036168
Absolute Maximum Ratings
Parameter Units
P
D
@T
C
= 25°C
Power Dissipation
W
P
D
@T
C
= 100°C
Power Dissipation
P
D
@T
A
= 25°C
Power Dissipation
T
P
Peak Soldering Temperature °C
T
J
Operating Junction and
T
STG
Storage Temperature Range
Thermal Resistance
Parameter Typ. Max. Units
R
θ
JA
Junction-to-Ambient ––– 45
R
θ
JA
Junction-to-Ambient 12.5 –––
R
θ
JA
Junction-to-Ambient 20 ––– °C/W
R
θ
J-Can
Junction-to-Can ––– 1.2
R
θ
J-PCB
Junction-to-PCB Mounted ––– 0.5
270
-55 to + 175
Max.
3.3
125
63

IRF7779L2TR1PBF

Mfr. #:
Manufacturer:
Infineon / IR
Description:
MOSFET 150V 67A 11mOhm 97nC Qg
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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