OP270 Data Sheet
Rev. F | Page 20 of 20
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-013- AA
032707-B
10.50 (0.4134)
10.10 (0.3976)
0.30 (0.0118)
0.10 (0.0039)
2.65 (0.1043)
2.35 (0.0925)
10.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
0
.
7
5
(
0
.
0
2
9
5
)
0
.
2
5
(
0
.
0
0
9
8
)
45°
1.27 (0.0500)
0.40 (0.0157)
OPLANARITY
0.10
0.33 (0.0130)
0.20 (0.0079)
0.51 (0.0201)
0.31 (0.0122)
SEATING
PLANE
8°
0°
16
9
8
1
1.27 (0.0500)
BSC
Figure 50. 16-Lead Standard Small Outline Package [SOIC_W]
Wide Body
S-Suffix
(RW-16)
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
Model
1
T
A
= +25°C
V
OS
Max (μV)
θ
JC
(°C/W)
θ
JA
2
(°C/W) Temperature Range Package Description
Package
Option
OP270EZ 75 12 134 −40°C to +85°C 8-Lead CERDIP Q-8 (Z-Suffix)
OP270FZ 150 12 134 −40°C to +85°C 8-Lead CERDIP Q-8 (Z-Suffix)
OP270GP 250 37 96 −40°C to +85°C 8-Lead PDIP N-8 (P-Suffix)
OP270GPZ −40°C to +85°C 8-Lead PDIP N-8 (P-Suffix)
OP270GS 250 27 92 −40°C to +85°C 16-Lead SOIC_W RW-16 (S-Suffix)
OP270GS-REEL −40°C to +85°C 16-Lead SOIC_W RW-16 (S-Suffix)
OP270GSZ −40°C to +85°C 16-Lead SOIC_W RW-16 (S-Suffix)
OP270GSZ-REEL −40°C to +85°C 16-Lead SOIC_W RW-16 (S-Suffix)
1
The OP270GPZ, OP270GSZ, and OP270GSZ-REEL are RoHS compliant parts.
2
θ
JA
is specified for worst-case mounting conditions, that is, θ
JA
is specified for device in socket for CERDIP and PDIP packages; θ
JA
is specified for device soldered to
printed circuit board for SOIC package.
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D00325-0-10/15(F)
