Data Sheet S19688EJ2V0DS
3
μ
PD166009
ABSOLUTE MAXIMUM RATING (Ta = 25°C, unless otherwise specified)
Parameter Symbol Test Conditions Rating Unit
VCC voltage VCC1 28 V
VCC voltage (Load Dump) VCC2
R
I = 1 Ω, RL = 1.5 Ω, td = 400 ms,
R
IS = 1 kΩ, IN = low or high
40 V
VCC voltage (Reverse polarity) -VCC
R
L = 2.2 Ω, 1 minute
−16 V
Load current IL DC, TC = 25°C 30 A
Load current (short circuit
current)
I
L(SC)
Self Limited A
Power dissipation PD TC = 25°C 59 W
Inductive load switch-off energy
dissipation single pulse
E
AS1 IL = 10 A, VCC = 12 V, Tch,start ≤ 150°C,
refer to page 16
50 mJ
Maximum allowable energy
under over load condition
(Single pulse)
E
AS2 VCC = 18 V, Tch,start ≤ 150°C, Rsupply = 10 mΩ,
R
short = 50 mΩ, Lsupply = 5
μ
H, Lshort = 15
μ
H,
refer to page 16
105 mJ
Channel temperature Tch −40 to +150 °C
Storage temperature Tstg −55 to +150 °C
HBM AEC-Q100-002 std.
R = 1.5 kΩ, C = 100pF
2000 V Electric discharge capability VESD
MM AEC-Q100-003 std.
R = 0 Ω, C = 200pF
400 V
DC VCC−28 V V Voltage of IN pin VIN
Reverse polarity condition, 1 minute V
CC+14 V V
DC VCC−28 V V Voltage of IS pin VIS
Reverse polarity condition, 1 minute V
CC+14 V V
RECOMMENDED OPERATING CONDITIONS
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Power supply voltage VCC Tch = −40 to 150°C 8
−
18 V
Cautions 1. It is assumed that VIN = 0 V when the device is activated.
2. Device operating range is limited by energy dissipation capability of the driver. User must
carefully consider worst case load and current conditions in combination of operating voltage.
THERMAL CHARACTERISTICS
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Rth(ch-a)
Device on 50 mm x 50 mm x 1.5 mmt
epoxy PCB FR-4 with 6 cm
2
of 70
μ
m
copper area
−
45 55 °C/W
Thermal resistance
R
th(ch-c)
− −
3.17 °C/W
