96SD2-1G800NN-TR1

T
T
T
S
S
S
2
2
2
Q
Q
Q
S
S
S
U
U
U
2
2
2
3
3
3
0
0
0
0
0
0
3
3
3
-
-
-
4
4
4
S
S
S
200PIN DDR2 800 SO-DIMM
1GB With 128Mx8 CL6
Transcend Information Inc.
Block Diagram
BA 0~BA2
Note:
1.DQ,D M,DQS & /DQS resistors :22 O hm s± 5%
2.Bx,A x,/R AS , /CA S & /W E resistors :3 Ohms± 5%
CK0
A0~A13
/R AS
/C AS
/W E
U0~U7
U0~U7
U0~U7
U0~U7
U0~U7
/C K0
4 loads
DQS
/
DQS
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
/CS O DT C KE
D0
DQS
/
DQS
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
/CS O DT C KE
D1
DQS
/
DQS
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
/CS O DT C KE
D2
DQS
/
DQS
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
/CS O DT C KE
D3
DQS
/
DQS
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
/C S O DT CKE
D4
DQS
/
DQS
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
/C S O DT CKE
D5
DQS
/
DQS
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
/C S O DT CKE
D2
DQS
/
DQS
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
/C S O DT CKE
D7
D Q0
D Q1
D Q2
D Q3
D Q4
D Q5
D Q6
D Q7
DQS0
/D Q S0
DM0
DQ8
DQ9
DQ10
DQ 11
DQ 12
DQ 13
DQ 14
DQ 15
DQ S1
/D Q S1
DM 1
D Q 16
D Q 17
D Q 18
D Q 19
D Q 20
D Q 21
D Q 22
D Q 23
DQ S2
/D Q S2
DM 2
D Q 24
D Q 25
D Q 26
D Q 27
D Q 28
D Q 29
D Q 30
D Q 31
DQ S3
/D Q S3
DM 3
D Q 32
D Q 33
D Q 34
D Q 35
D Q 36
D Q 37
D Q 38
D Q 39
DQS4
/D Q S4
DM 4
D Q 40
D Q 41
D Q 42
D Q 43
D Q 44
D Q 45
D Q 46
D Q 47
DQS5
/D Q S5
DM 5
D Q 48
D Q 49
D Q 50
D Q 51
D Q 52
D Q 53
D Q 54
D Q 55
DQS6
/D Q S6
DM 6
D Q 56
D Q 57
D Q 58
D Q 59
D Q 60
D Q 61
D Q 62
D Q 63
DQS7
/D Q S7
DM 7
CK1
/C K 1
4 loads
CKE0
OD T0
/C S 0
SDA
SCL
A0 A1 A2
EEPR O M
SA0 SA1
W P
SCL
VDDSPD
VD D/VD D Q
VREF
VSS
EE P R O M
U0~U7
U0~U7
U0~U7
This technical information is based on industry standard data and tests believed to be reliable. However, Transcend makes no warranties, either
expressed or implied, as to its accuracy and assume no liability in connection with the use of this product. Transcend reserves the right to make changes
in specifications at any time without prior notice.
T
T
T
S
S
S
2
2
2
Q
Q
Q
S
S
S
U
U
U
2
2
2
3
3
3
0
0
0
0
0
0
3
3
3
-
-
-
4
4
4
S
S
S
200PIN DDR2 800 SO-DIMM
1GB With 128Mx8 CL6
Transcend Information Inc.
Absolute Maximum DC Ratings
Parameter Symbol Value Unit Notes
Voltage on V
DD
relative to Vss VDD -1.0 ~ 2.3 V 1
Voltage on V
DDQ
pin relative to Vss VDDQ -0.5 ~ 2.3 V 1
Voltage on V
DDL
pin relative to Vss VDDL -0.5 ~ 2.3 V 1
Voltage on any pin relative to Vss VIN, VOUT -0.5 ~ 2.3 V 1
Storage temperature T
STG
-55~+100 °C 1, 2
1.Stress greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at these or any other conditions
above those indicated in the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect reliability.
Note:
2.Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the
measurement conditions, please refer to JESD51-2 standard.
AC & DC Operating Conditions
Recommended DC operating conditions (SSTL –1.8)
Rating
Parameter Symbol
Min Typ. Max
Unit
Notes
Supply voltage VDD 1.7 1.8 1.9 V
Supply voltage for DLL VDDL 1.7 1.8 1.9 V
4
Supply voltage for Output VDDQ 1.7 1.8 1.9 V
4
I/O Reference voltage VREF 0.49*VDDQ
0.50*VDDQ
0.51*VDDQ V
1, 2
I/O Termination voltage VTT V
REF
-0.04 V
REF
V
REF
+0.04 V
3
DC Input logic high VIH
(DC)
V
REF
+0.125
- V
DDQ
+0.3 V
DC Input logic low VIL
(DC)
-0.3 - V
REF
-0.125 V
There is no specific device VDD supply voltage requirement for SSTL-1.8 compliance. However under all
conditions VDDQ must be less than or equal to VDD.
1.The value of VREF may be selected by the user to provide optimum noise margin in the system. Typically the
value of VREF is expected to be about 0.5 x VDDQ of the transmitting device and VREF is expected to track
variations in VDDQ.
2.Peak to peak AC noise on VREF may not exceed +/-2% VREF (DC).
3.VTT of transmitting device must track VREF of receiving device.
Note:
4.AC parameters are measured with VDD, VDDQ and VDDDL tied together.
Operating Temperature Condition
Parameter Symbol
Rating
Unit
Note
Operating Temperature TOPER
0 to 85 °C
1, 2
1.Operating Temperature is the case surface temperature on the center/top side of the DRAM. For the
measurement conditions, please refer to JESD51.2 standard.
2. At 0 - 85°C, operation temperature range are the temperature which all DRAM specification will be supported.
Note:
T
T
T
S
S
S
2
2
2
Q
Q
Q
S
S
S
U
U
U
2
2
2
3
3
3
0
0
0
0
0
0
3
3
3
-
-
-
4
4
4
S
S
S
200PIN DDR2 800 SO-DIMM
1GB With 128Mx8 CL6
Transcend Information Inc.
IDD Specification parameters Definition
( IDD values are for full operating range of voltage and Temperature)
Parameter Symbol
Max.
Unit
Note
Operating One bank Active-Precharge current; tCK = tCK(IDD), tRC = tRC(IDD),
tRAS = tRASmin(IDD); CKE is HIGH, /CS is HIGH between valid commands;
Address bus inputs are SWITCHING; Data bus inputs are SWITCHING
IDD0 520 mA
Operating One bank Active-read-Precharge current; IOUT = 0mA; BL = 4, CL =
CL(IDD), AL = 0; tCK = tCK(IDD), tRC = tRC (IDD), tRAS = tRASmin(IDD), tRCD =
tRCD(IDD); CKE is HIGH, /CS is HIGH between valid commands; Address bus
inputs are SWITCHING; Data pattern is same as IDD4W
IDD1 600 mA
Precharge power-down current; All banks idle; tCK = tCK(IDD); CKE is LOW;
Other control and address bus inputs are STABLE; Data bus inputs are FLOATING
IDD2P
80 mA
Precharge quiet standby current; All banks idle; tCK = tCK(IDD); CKE is HIGH,
CS\ is HIGH; Other control and address bus inputs are STABLE; Data bus inputs are
FLOATING
IDD2Q
200 mA
Precharge standby current; All banks idle; tCK = tCK(IDD); CKE is HIGH, /CS is
HIGH; Other control and address bus inputs are SWITCHING; Data bus inputs are
SWITCHING
IDD2N
256 mA
Fast PDN Exit MRS(12) = 0
IDD3P-F
224
Active power - down current;
All banks open; tCK
= tCK(IDD); CKE is LOW; Other control and address
bus inputs are STABLE; Data bus inputs are
FLOATING
Slow PDN Exit MRS(12) = 1 IDD3P-S
120
mA
Active standby current; All banks open; tCK = tCK(IDD), tRAS = tRASmax(IDD),
tRP = tRP(IDD); CKE is HIGH, /CS is HIGH between valid commands; Other control
and address bus inputs are SWITCHING; Data bus inputs are SWITCHING
IDD3N
320 mA
Operating burst read current; All banks open, Continuous burst reads, IOUT =
0mA; BL = 4, CL = CL(IDD), AL = 0; tCK = tCK(IDD), tRAS = tRASmax(IDD), tRP =
tRP(IDD); CKE is HIGH, /CS is HIGH between valid commands; Address bus inputs
are SWITCHING; Data pattern is same as IDD4W
IDD4R
1,000
mA
Operating burst write current; All banks open, Continuous burst writes; BL = 4, CL
= CL(IDD), AL = 0; tCK = tCK(IDD), tRAS = tRASmax(IDD), tRP = tRP(IDD); CKE is
HIGH, CS\ is HIGH between valid commands; Address bus inputs are SWITCHING;
Data bus inputs are SWITCHING
IDD4W
760 mA
Burst Auto refresh current;
tCK = tCK(IDD); Refresh command at every tRFC(IDD)
interval; CKE is HIGH, /CS is HIGH between valid commands; Other control and
address bus inputs are SWITCHING; Data bus inputs are SWITCHING
IDD5B
816 mA
Self refresh current; CK and /CK at 0V; CKE 0.2V; Other control and address
bus inputs are FLOATING; Data bus inputs are FLOATING
IDD6 80 mA
Operating bank interleave read current; All bank interleaving reads, IOUT = 0mA;
BL = 4, CL = CL(IDD), AL = tRCD(IDD)-
1*tCK(IDD); tCK =tCK(IDD), tRC = tRC(IDD),
tRRD = tRRD(IDD), tRCD = 1*tCK(IDD); CKE is HIGH, CS\ is HIGH between valid
commands; Address bus inputs are STABLE during Deselects; Data pattern is same
as IDD4R; Refer to the following page for detailed timing conditions
IDD7 1,600
mA
Note: 1. Module I
DD
was calculated on the basis of component I
DD
and can be differently measured according to DQ
loading capacitor.

96SD2-1G800NN-TR1

Mfr. #:
Manufacturer:
Advantech
Description:
Memory Modules 1G SO-DDR2-800 200PIN 128X8 SAM(G)
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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