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Document Number: 65578
S09-2431-Rev. A, 16-Nov-09
Vishay Siliconix
SiE864DF
New Product
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
b. Maximum under Steady State conditions is 68 °C/W.
c. Measured at source pin (on the side of the package).
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
a, b
t ≤ 10 s R
thJA
20 24
°C/W
Maximum Junction-to-Case (Drain Top)
Steady State
R
thJC
(Drain)
45
Maximum Junction-to-Case (Source)
a, c
R
thJC
(Source)
5.5 7
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage V
DS
V
GS
= 0 V, I
D
= 250 µA
30 V
V
DS
Temperature Coefficient ΔV
DS
/T
J
I
D
= 250 µA
30
mV/°C
V
GS(th)
Temperature Coefficient ΔV
GS(th)
/T
J
- 5.5
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA
12V
Gate-Source Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 20 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= 30 V, V
GS
= 0 V
1
µA
V
DS
= 30 V, V
GS
= 0 V, T
J
= 55 °C
10
On-State Drain Current
a
I
D(on)
V
DS
≥ 5 V, V
GS
= 10 V
25 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= 10 V, I
D
= 20 A
0.0046 0.0056
Ω
V
GS
= 4.5 V, I
D
= 20 A
0.006 0.0073
Forward Transconductance
a
g
fs
V
DS
= 15 V, I
D
= 20 A
74 S
Dynamic
b
Input Capacitance
C
iss
V
DS
= 15 V, V
GS
= 0 V, f = 1 MHz
1510
pF
Output Capacitance
C
oss
330
Reverse Transfer Capacitance
C
rss
130
Total Gate Charge
Q
g
V
DS
= 15 V, V
GS
= 10 V, I
D
= 20 A
25 38
nC
V
DS
= 15 V, V
GS
= 4.5 V, I
D
= 20 A
11.9 18
Gate-Source Charge
Q
gs
4.1
Gate-Drain Charge
Q
gd
3.6
Gate Resistance
R
g
f = 1 MHz 0.2 1.2 2.4 Ω
Tur n - On D elay T ime
t
d(on)
V
DD
= 15 V, R
L
= 1.5 Ω
I
D
≅ 10 A, V
GEN
= 4.5 V, R
g
= 1 Ω
20 30
ns
Rise Time
t
r
17 30
Turn-Off Delay Time
t
d(off)
25 40
Fall Time
t
f
12 20
Tur n - On D elay T im e
t
d(on)
V
DD
= 15 V, R
L
= 1.5 Ω
I
D
≅ 10 A, V
GEN
= 10 V, R
g
= 1 Ω
12 20
Rise Time
t
r
10 15
Turn-Off Delay Time
t
d(off)
25 40
Fall Time
t
f
10 15
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
I
S
T
C
= 25 °C
20.8
A
Pulse Diode Forward Current
a
I
SM
100
Body Diode Voltage
V
SD
I
S
= 10 A
0.8 1.2 V
Body Diode Reverse Recovery Time
t
rr
I
F
= 10 A, dI/dt = 100 A/µs, T
J
= 25 °C
30 45 ns
Body Diode Reverse Recovery Charge
Q
rr
24 36 nC
Reverse Recovery Fall Time
t
a
16
ns
Reverse Recovery Rise Time
t
b
14
